tag: Mentor

Going Deep Or Broad With Formal?
By Ann Mutschler - 28 Mar, 2018 - Comments: 0

Whether to apply [getkc id="33" comment="formal verification"] technology to semiconductor design broadly or deeply is a tough question. It hinges on what is the best way to achieve maximum ROI. Do you want to identify hard to find bugs, and get a certain level of confidence about a block? Where should the effort be placed? Is it by going deep, meaning a team of specialists or experts must b... » read more

When AI Goes Awry
By Ed Sperling - 26 Mar, 2018 - Comments: 0

The race is on to develop intelligent systems that can drive cars, diagnose and treat complex medical conditions, and even train other machines. The problem is that no one is quite sure how to diagnose latent or less-obvious flaws in these systems—or better yet, to prevent them from occurring in the first place. While machines can do some things very well, it's still up to humans to devise... » read more

Verification And Validation Brothers
By Brian Bailey - 22 Mar, 2018 - Comments: 0

At DVCon this year, Doug Amos took the stage for the [getentity id="22017" e_name="Mentor, a Siemens Business"] sponsored lunch presentation. For those of you who were there but decided to skip the lunch, expecting the traditional forced sales pitch, you made a mistake. Amos is one of those rare people who know how to inject humor, teaching and marketing into a single presentation such that the... » read more

How Automotive ICs Are Reshaping Semiconductor Test
By Steve Pateras - 22 Mar, 2018 - Comments: 0

The growth of a new IC market creates ripples along the entire supply chain. Today, we see the semiconductor industry reacting to the needs of the growing automotive IC market, including the development of new IC test tools and methods. The automotive IC market is far and away the fastest growing end-use market with 15% CAGR (according to IC Insights). It is also seeing many new players. Mar... » read more

Applying Machine Learning To Chips
By Ann Mutschler - 22 Mar, 2018 - Comments: 0

The race is on to figure out how to apply analytics, data mining and machine learning across a wide swath of market segments and applications, and nowhere is this more evident than in semiconductor design and manufacturing. The key with ML/DL/AI is understanding how devices react to real events and stimuli, and how future devices can be optimized. That requires sifting through an expandi... » read more

Merging Verification With Validation
By Brian Bailey - 22 Mar, 2018 - Comments: 3

Verification and validation are two important steps in the creations of electronic systems and over time their roles, but how they play together is changing. In fact, today we are seeing a major opportunity for rethinking this aspect of the flow, which could mean the end of them as separate tasks for many of the chips being created. As with many things in this industry, however, squeezing it... » read more

The PCB Engineer’s Guide To Successful DDR Bus Design
By Mentor, a Siemens Business - 21 Mar, 2018 - Comments: 0

This paper tackles the critical signal integrity concerns encountered when designing, simulating, and analyzing DDR buses. The first section describes DDR bus design challenges that can be particularly problematic, even intimidating, to designers. Subsequent sections describe how simulation and analysis speed up the design of a functioning DDR system to reduce PCB spins and shorten the time to ... » read more

Blog Review: Mar. 21
By Jesse Allen - 21 Mar, 2018 - Comments: 0

Mentor's Colin Walls shares five more quick tips for embedded software programming, including t real time systems, programming philosophy, and C++ operator overloading. Cadence's Paul McLellan digs into recently released semiconductor company ratings, the role of memory in shaking up the list, and China's plans for more 3D NAND and DRAM fabs. Synopsys' Taylor Armerding examines the latest... » read more

EUV’s New Problem Areas
By Mark LaPedus - 19 Mar, 2018 - Comments: 2

Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue technology. GlobalFoundries, Intel, Samsung and TSMC hope to insert [gettech id="31045" comment="EUV"] lithography into production at 7nm and/or 5nm. But as before, EUV consists of several compo... » read more

The Week In Review: Design
By Jesse Allen - 16 Mar, 2018 - Comments: 0

Tools Synopsys debuted new versions of its circuit simulation and custom design products. FineSim SPICE provides 2X faster simulation and Monte Carlo analysis speed, CustomSim FastSPICE offers 2X speed-up for post-layout SRAM simulation and maintains multi-core scalability by providing additional 2X speed-up on four cores, and HSPICE delivers 1.5X speed-up for large post-layout designs, accord... » read more

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