tag: Mentor

Blog Review: March 29
By Jesse Allen - 29 Mar, 2023 - Comments: 0

Siemens' Heather George suggests adopting a shift-left strategy for complex designs that integrate multiple dies into a package and examines the challenges and opportunities for performing comprehensive tests on 2.5D and 3D IC designs. Synopsys' Shekhar Kapoor notes that when considering whether a system will perform as intended, techniques that work well for monolithic SoCs may not be as we... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 24 Mar, 2023 - Comments: 0

Automotive, mobility Ford expects to lose $3 billion from EV sales this year, but said that part of the business will begin generating profits soon. The company still expects to hit its overall profit numbers for the year, however. Volvo is making a new electric vehicle (EV) in China and exporting it to Europe and Japan, according to a Nikkei Asia interview. Volvo is owned by Zhejiang Geely... » read more

Week In Review: Design, Low Power
By Linda Christensen - 24 Mar, 2023 - Comments: 0

Renesas will acquire Panthronics, a fabless semiconductor company specializing in high-performance wireless products, expanding its reach into near-field communications for financial, IoT, asset tracking, wireless charging, and automotive applications. The two companies already had collaborated on designs for mobile point-of-sale terminals, wireless charging, and smart metering. Renesas also... » read more

True 3D Is Much Tougher Than 2.5D
By Brian Bailey - 23 Mar, 2023 - Comments: 0

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D designs, there are multiple interpretations about what 3D entails. This is more than just semantics, however, because each packaging option requires different design approaches and technologies. And a... » read more

The Race Toward Mixed-Foundry Chiplets
By Ann Mutschler - 23 Mar, 2023 - Comments: 1

Creating chiplets with as much flexibility as possible has captured the imagination of the semiconductor ecosystem, but how heterogeneous integration of chiplets from different foundries will play out remains unclear. Many companies in the semiconductor ecosystem are still figuring out how they will fit into this heterogeneous chiplet world and what issues they will need to solve. While near... » read more

System-on-Chip Design In The Cloud: One Size Does Not Fit All
By Nebabie Kebebew - 23 Mar, 2023 - Comments: 0

At an increasing pace, companies in the semiconductor ecosystem have started seriously considering the cloud for computing and storage. Some have migrated, and others are evaluating the cloud technology choices and are sizing the business impact and benefits to make the leap. Through key adoption reports, the cloud environment is proving to be beneficial for System-on-Chip (SoC) designers by pr... » read more

Managing EDA’s Rapid Growth Expectations
By Brian Bailey - 23 Mar, 2023 - Comments: 0

The EDA industry has been doing very well recently, but how long this run will continue is a matter of debate. EDA is an industry ripe for disruption due to rapid changes in chip architectures, end markets, and a long list of new technologies. In addition, recent geopolitical tensions are bringing a lot more attention to this small sector upon which the whole semiconductor industry rests. De... » read more

A Hierarchical And Tractable Mixed-Signal Verification Methodology For First-Generation Analog AI Processors
By Siemens EDA - 22 Mar, 2023 - Comments: 0

Artificial intelligence (AI) is now the key driving force behind advances in information technology, big data and the internet of things (IoT). It is a technology that is developing at a rapid pace, particularly when it comes to the field of deep learning. Researchers are continually creating new variants of deep learning that expand the capabilities of machine learning. But building systems th... » read more

Blog Review: March 22
By Jesse Allen - 22 Mar, 2023 - Comments: 0

Siemens EDA's Dan Yu warns that the unavailability of verification data is slowing down the development of advanced machine learning for verification, with valuable data assets either siloed among different team members or projects or simply discarded due to the lack of analytic techniques to extract value from them. Synopsys' Richard Solomon and Dana Neustadter point to the need for hardwar... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 17 Mar, 2023 - Comments: 0

North Americas’s first zero-emission hydrogen-powered “Train de Charlevoix” will start running in Canada this summer, with speeds up to 85 mph, only emitting water vapor. Germany rolled out the world’s first passenger train fleet in 2022. The U.S. Department of Energy announced the availability of $750 million for R&D to further clean hydrogen technologies, part of the Biparti... » read more

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