tag: Nvidia

New Standards Push Co-Packaged Optics
By Karen Heyman - 26 Apr, 2023 - Comments: 0

Co-packaged optics (CPOs) promise five times the bandwidth of pluggable connections, but the new architecture requires multiple changes to accommodate different applications. The Optical Internetworking Forum (OIF) recently published standards for co-packaged optics, which are the photonic industry’s hope for handling today’s faster Ethernet interfaces, as well as increasing speeds and p... » read more

Chip Industry’s Technical Paper Roundup: Apr. 18
By Linda Christensen - 18 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=93 /]   If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involv... » read more

Autonomous Driving: End-to-End Surround 3D Camera Perception System (NVIDIA)
By Technical Paper Link - 10 Apr, 2023 - Comments: 0

A new technical paper titled "NVAutoNet: Fast and Accurate 360∘ 3D Visual Perception For Self Driving" was published by researchers at NVIDIA. Abstract "Robust real-time perception of 3D world is essential to the autonomous vehicle. We introduce an end-to-end surround camera perception system for self-driving. Our perception system is a novel multi-task, multi-camera network which takes a... » read more

Chip Industry’s Technical Paper Roundup: Apr. 4
By Linda Christensen - 04 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=90 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Week In Review: Design, Low Power
By SE Staff - 31 Mar, 2023 - Comments: 0

Synopsys rolled out an AI-driven design suite called Synopsys.ai at the Synopsys User Group conference this week, which it says reduces time to better results at multiple points in the design flow. The company noted the new technology uses reinforcement learning, which compensates for relatively small data sets by allowing engineers to interact with that data more easily at any point, and to ch... » read more

Combination of AI Techniques To Find The Best Ways to Place Transistors on Silicon Chips
By Technical Paper Link - 30 Mar, 2023 - Comments: 0

A new technical paper titled "AutoDMP: Automated DREAMPlace-based Macro Placement" was published by researchers at NVIDIA. Abstract: "Macro placement is a critical very large-scale integration (VLSI) physical design problem that significantly impacts the design power-performance-area (PPA) metrics. This paper proposes AutoDMP, a methodology that leverages DREAMPlace, a GPU-accelerated place... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 24 Mar, 2023 - Comments: 0

TEL announced plans to build a ¥2.2 billion ($168.2 million) production and logistics center at its Tohoku Office to increase capacity. Construction of the 57,000m² facility, which will be used for manufacturing thermal processing and single-wafer deposition systems, is slated to start in spring 2024, and expected to be completed in fall 2025. Toshiba's board voted in favor of a 2 trillio... » read more

Week In Review: Design, Low Power
By Linda Christensen - 24 Mar, 2023 - Comments: 0

Renesas will acquire Panthronics, a fabless semiconductor company specializing in high-performance wireless products, expanding its reach into near-field communications for financial, IoT, asset tracking, wireless charging, and automotive applications. The two companies already had collaborated on designs for mobile point-of-sale terminals, wireless charging, and smart metering. Renesas also... » read more

Chip Industry’s Technical Paper Roundup: Mar. 21
By Linda Christensen - 21 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=88 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Learning The AMS Circuit Representation From Layout Positions (UT Austin/ NVIDIA)
By Technical Paper Link - 15 Mar, 2023 - Comments: 0

A recent technical paper titled "TAG: Learning Circuit Spatial Embedding From Layouts" was published by researchers at UT Austin and NVIDIA. Abstract "Analog and mixed-signal (AMS) circuit designs still rely on human design expertise. Machine learning has been assisting circuit design automation by replacing human experience with artificial intelligence. This paper presents TAG, a new parad... » read more

← Older posts Newer posts →

  • Sponsors

  • Standards/Organizations

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy