tag: Siemens EDA

Blog Review: April 22
By Jesse Allen - 22 Apr, 2015 - Comments: 0

DARPA thinks machine-brain interfaces are poised to become an industry-changing technology. Rambus' David G. Stork brings us emerging developments in the field from the Neural Engineering Boot Camp. If you live in an area that doesn't get quite enough sun for solar panels, how about a smart window that harvests energy from wind and rain? In this week's top five picks, Ansys' Justin Nescott a... » read more

Week 45: 7 Weeks To DAC
By Anne Cirkel - 17 Apr, 2015 - Comments: 0

Make sure to download and use the mobile app for #52DAC this year. It will make your time at the conference a lot easier and should even bring you a bit of fun — and a chance to win a new Apple watch. This year the app includes a game called DAC Attack. No, you don’t score by throwing virtual tomatoes at the executive committee, though we can help you rack up points. (More on this in a b... » read more

Are Three Eyes Better Than Two?
By David Abercrombie - 16 Apr, 2015 - Comments: 0

It is clear that having two eyes is better than having just one. Not only is depth perception much better, but we get to enjoy 3D movies because of it. There is also some sense of security in knowing that if something terrible happened to one eye, you always have a backup. Have you ever wondered if these sorts of advantages are extendable? You’ve probably heard the phrase about someone ha... » read more

Big Changes At 10nm And Beyond
By Ed Sperling - 16 Apr, 2015 - Comments: 0

The move to 16/14nm finFETs is relatively straightforward. The move to 10nm and 7nm will be quite different. While double patterning with colors at 16/14nm has a rather steep learning curve, reports from chipmakers developing advanced chips is the technology and methodologies are manageable once engineering teams begin working with it. The hardest part is visualizing how different parts will... » read more

New Patterning Paradigm?
By Mark LaPedus - 16 Apr, 2015 - Comments: 0

Chip scaling is becoming more difficult at each process node, but the industry continues to find new and innovative ways to solve the problems at every turn. And so chipmakers continue to march down the various process nodes. But the question is for how much longer? In fact, at 16nm/14nm and beyond, chipmakers are finding new and different challenges, which, in turn, could slow IC scaling or br... » read more

FinFET Rollout Slower Than Expected
By Mark LaPedus - 16 Apr, 2015 - Comments: 1

The foundry business is heating up as some new and large players are entering the 16nm/14nm [getkc id="185" kc_name="finFET"] market. But foundry customers are taking longer than expected to migrate to finFETs amid some technical and cost issues. On the foundry front, [getentity id="22846" comment="Intel"] has been the sole player in finFETs for some time. But now, [getentity id="22865" ... » read more

Faster Time To Root Cause With Diagnosis-Driven Yield Analysis
By Mentor, a Siemens Business - 16 Apr, 2015 - Comments: 0

ICs developed at advanced technology nodes of 65 nm and below exhibit an increased sensitivity to small manufacturing variations. New design-specific and feature-sensitive failure mechanisms are on the rise. Complex variability issues that involve interactions between process and layout features can mask systematic yield issues. Without improved yield analysis methods, time-to-volume is delayed... » read more

Blog Review: April 15
By Jesse Allen - 15 Apr, 2015 - Comments: 0

How much memory do you need to look 13 billion years in the past? Rambus' Aharon Etengoff ponders the Square Kilometre Array's massive number of radio telescopes and what it means for computing. NXP's Martin Schoessler argues that for smart cities to work for their citizens, both technology companies and government entities will need a new mind-set. Reinventing the wheel is a good thing i... » read more

EDA Sets New Record
By Ed Sperling - 13 Apr, 2015 - Comments: 0

EDA revenue grew 11.9% in Q4 2014 to $2.1 billion, a new record for the industry, propelled by strong growth in both IP and physical design. On a sequential basis, that represented a 15.1% increase, while on a year-over-year basis it was 11.9%. The four-quarter moving average, which takes into account quarterly aberrations, showed a 7.3% increase. "The semiconductor industry had a strong ... » read more

Week 44: IoT impossible Without EDA
By Anne Cirkel - 10 Apr, 2015 - Comments: 1

Hype and timing aside, the IoT is likely to be the Internet’s next wave. Like all new waves, IoT probably won’t bear much resemblance to the descriptions of today’s prognosticators, though will lean heavily on earlier work and innovation – including by the EDA technologies that remain the core of DAC and our multibillion dollar industry, and the prime enabler of electronic design at lar... » read more

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