tag: Siemens

Data Confusion At The Edge
By Ed Sperling - 11 Jun, 2019 - Comments: 0

Disparities in pre-processing of data at the edge, coupled with a total lack of standardization, are raising questions about how that data will be prioritized and managed in AI and machine learning systems. Initially, the idea was that 5G would connect edge data to the cloud, where massive server farms would infer patterns from that data and send it back to the edge devices. But there is far... » read more

Tessent Hierarchical ATPG Reference Flow for Arm Cortex-A75
By Mentor, a Siemens Business - 11 Jun, 2019 - Comments: 0

Arm and Mentor have jointly developed a reference flow for a hierarchical DFT and ATPG implementation with Tessent for any Arm subsystem based on Cortex A-series IP. The reference flow, described in this paper, provides documentation, seamless interfaces, and scripts that accelerate the implementation of a hierarchical test solution. Arm and Mentor are dedicated to enabling customer success, re... » read more

Smart Plug-And-Play DFT For Arm Cores
By Ron Press - 11 Jun, 2019 - Comments: 0

Modern SoCs are experiencing continued growth in capabilities and design sizes with more and more subsystem IPs being implemented. These large, complex, multi-core SoCs need strategies for DFT and ATPG that effectively reduce DFT effort, minimize ATPG runtime, and still achieve the target test coverage. Hierarchical DFT enables designing and testing of these designs in a systematic and repeatab... » read more

Disregard Safety And Security At Your Own Peril
By Brian Bailey - 10 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss industry attitudes towards safety and security with Dave Kelf, chief marketing officer for Breker Verification; Jacob Wiltgen, solutions architect for functional safety at Mentor, a Siemens Business; David Landoll, solutions architect for OneSpin Solutions; Dennis Ciplickas, vice president of characterization solutions at PDF Solutions; Andrew Dauma... » read more

Week In Review: Design, Low Power
By Jesse Allen - 07 Jun, 2019 - Comments: 0

M&A Infineon Technologies will acquire Cypress Semiconductor for $23.85 per share in cash, or $10.1 billion. The deal will place Infineon as the number eight chip manufacturer in the world based on 2018 revenues and create an automotive powerhouse, making the combined company the largest supplier of chips to the automotive market. Infineon sees potential to reach into new industrial and co... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 07 Jun, 2019 - Comments: 0

Products/Services Achronix Semiconductor selected the Rambus GDDR6 PHY for its next-generation Speedster7t line of field-programmable gate arrays. The Rambus GDDR6 PHY is used in advanced driver-assistance systems, artificial intelligence, graphics, machine learning, and networking applications. Arm and Marvell Technology Group will work together on design and development of Marvell’s nex... » read more

Machine Learning Drives High-Level Synthesis Boom
By Kevin Fogarty - 06 Jun, 2019 - Comments: 0

High-level synthesis (HLS) is experiencing a new wave of popularity, driven by its ability to handle machine-learning matrices and iterative design efforts. The obvious advantage of HLS is the boost in productivity designers get from working in C, C++ and other high-level languages rather than RTL. The ability to design a layout that should work, and then easily modify it to test other confi... » read more

In Automotive, A Move From Microcontrollers To Massively Complex SoCs
By Andrew Macleod - 06 Jun, 2019 - Comments: 1

Cars and custom, high-end chips. It’s a topic coming up more frequently these days. The most prominent example is Tesla’s FSD computer, described by Elon Musk as “the best chip in the world…objectively” during the company’s April Autonomy Day. When it comes to chips, Tesla is alone only when it comes to hyperbole, at least based on browsing job postings for big carmakers and supplie... » read more

Toshiba Verifies Thermal Contribution In Motor Control Driver ICs
By Mentor, a Siemens Business - 05 Jun, 2019 - Comments: 0

High output current ICs usually generate a lot of heat from the driver transistor, which affects the surrounding circuits. Therefore, it is important to take into account the transient heat based on the output current level when designing applications such as engine throttles or on/off switches for engine bulbs. In this whitepaper, the Toshiba team discusses how they used the Eldo circuit simul... » read more

Training Tomorrow’s Chip Designers
By Ann Mutschler - 05 Jun, 2019 - Comments: 1

With technology advancing rapidly and the growing number of open R&D projects, there is an expanding need for qualified engineers. To make this possible, practical education needs to start much earlier than after graduation. One the best ways the EDA and semiconductor industry has embraced is encouraging engineering students to cooperate with experienced engineers, technologists and indu... » read more

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