tag: Synopsys

Competing Auto Sensor Fusion Approaches
By Bryon Moyer - 07 Oct, 2021 - Comments: 0

As today’s internal-combustion engines are replaced by electric/electronic vehicles, mechanical-system sensors will be supplanted by numerous electronic sensors both for efficient operation and for achieving various levels of autonomy. Some of these new sensors will operate alone, but many prominent ones will need their outputs combined — or “fused” — with the outputs of other sensor... » read more

Using Machine Learning For Characterizations Of NoC Components
By Arteris - 06 Oct, 2021 - Comments: 0

Modern NoC (Network-on-Chip) is built of complex functional blocks, such as packet switches and protocol converters. PPA (performance/power/area) estimates for these components are highly desirable during early design phases – long before NoC gate level netlist is synthesized. At this stage a NoC component is a soft module, described by a set of architectural parameters, like the bit width of... » read more

The 5 Essential Elements Of A Successful Software Security Initiative
By Synopsys - 06 Oct, 2021 - Comments: 0

Every organization that develops or integrates software needs a software security initiative—a blend of people, processes and tools that ensures applications and the data they process are secure. As customers, regulators, executives and boards of directors start asking for evidence of a formal approach to software security, organizations are trying to determine where to start, how to construc... » read more

Blog Review: Oct. 6
By Jesse Allen - 06 Oct, 2021 - Comments: 0

Arizona State University's Jae-sun Seo and Arm's Paul Whatmough introduce a fully-parallel and fully-pipelined FPGA accelerator for sparse CNNs that can eliminate off-chip memory access and also efficiently support elementwise pruning of CNN weights. Cadence's Paul McLellan highlights trends seen at the recent Hot Chips, from machine learning and advanced packaging driving higher performance... » read more

Week In Review: Design, Low Power
By Jesse Allen - 01 Oct, 2021 - Comments: 0

Valens Semiconductor began trading on the New York Stock Exchange as VLN after a merger with special-purpose acquisition company (SPAC) PTK Acquisition Corp. Valens offers high-speed connectivity chips for the audio-video and automotive markets, including its HDBaseT technology for connectivity between ultra-HD video sources and remote displays and its in-vehicle high-speed links. The transacti... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 01 Oct, 2021 - Comments: 0

Automotive GM’s self-driving car Cruise and Alphabet’s Waymo have won permits to offer rides to passengers in California. Ford Motor Company announced it is expanding its electric pickup truck assembly lines. With SK Innovation, Ford will create a 3,600-acre mega campus in west Tennessee to produce electric trucks. The company estimates the campus will add 6,000 new jobs to the economy.... » read more

Overview Of Medical Chip Challenges
By SE Staff - 30 Sep, 2021 - Comments: 0

Medical devices are adopting, and increasingly adapting, a variety of semiconductor technologies to provide new functions and capabilities in smaller form factors. In doing so, they are leveraging increasing processing capabilities, lower power, and new types of sensors to propel health care forward. Many different chip types have been used in medical devices for years, many of them develope... » read more

Blog Review: Sept. 29
By Jesse Allen - 29 Sep, 2021 - Comments: 0

Cadence's Paul McLellan checks out two of the biggest chips presented at the recent Hot Chips: a graphics chip from Intel for an upcoming supercomputer and Cerebras' wafer-scale AI chip. Synopsys' Datsen Davies Tharakan lists the top five design challenges for electric vehicles and power semiconductors and why a robust design flow can accelerate the growth of hybrid and electric vehicles goi... » read more

EDA Vendors Widen Use Of AI
By Ed Sperling - 29 Sep, 2021 - Comments: 0

EDA vendors are widening the use of AI and machine learning to incorporate multiple tools, providing continuity and access to consistent data at multiple points in the semiconductor design flow. While gaps remain, early results from a number of EDA tools providers point to significant improvements in performance, power, and time to market. AI/ML has been deployed for some time in EDA. Still,... » read more

3D IC: Opportunities, Challenges, And Solutions
By Kenneth Larsen - 28 Sep, 2021 - Comments: 0

Nearly every big city reaches a point in its evolution when it runs out of open space and starts building vertically. This enables far more apartments, offices and people per square mile, while avoiding the increased infrastructure costs of suburban sprawl. Semiconductors are evolving in much the same way. Moore’s Law is slowing, and adoption of new advanced technology nodes is slowing as wel... » read more

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