Advanced Electrical Test Capability For Better Defect Signature Detection In Advanced Package Development


As the semiconductor world excitingly explores the potential of new advanced package solutions for their intricate and novel designs, challenges arise from undetected defects caused by the complexity of the designs and the lack of accessibility to the interconnects for testing. This typically results in a long cycle time to achieve yield entitlement. Undetected defects at the development stage ... » read more

Data Feed Forward And How It Works: Part 1


With data analytics, manufacturers can gain unparalleled insights into their testing processes, identify patterns, predict failures, and optimize operations. From improving yield rates to reducing testing costs, data analytics not only enhance the quality of semiconductor devices but also drives innovation and competitiveness in the industry. Traditionally, data analytics has been performed ... » read more

Test Hyperconvergence In Semiconductor Development


Back when semiconductor devices contained only a few thousand gates, manufacturing test was almost an afterthought. The development team threw the chip “over the wall” to the test engineers, who developed a set of test patterns for the manufacturing floor. As this process became more automated and chips became more complicated, test considerations crept into the development flow and design-... » read more

Redefining Sustainability: Operational Resilience Is the New Frontier


Powering everything from smartphones, energy infrastructure, electric transport, and AI systems, semiconductors have become a cornerstone of economic innovation. However, rapid progress has an impact. One recent survey shows that the semiconductor device manufacturing industry more than doubled its annual electricity consumption between 2015 and 2023 – an increase of 125% during that period. ... » read more

Easing The Stress For Package-Level Burn-In


Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and multi-chiplet packages become more common, and concerns about aging circuitry heighten, shifting stress testing to the wafer level looks increasingly attractive from a quality, throughput, and cost standp... » read more

The Data Dilemma In Semiconductor Testing And Why It Matters: Part 2


In Part 1, we explored the challenges of implementing machine learning and real-time analytics in semiconductor testing—chiefly, the difficulty of transferring device test data across multiple locations and organizations. In this post, we introduce Data Feed Forward (DFF) as it applies to ACS Advantest. What is ACS DFF? ACS DFF is a cloud-enabled solution designed to simplify, secure... » read more

In-System/In-Field Testing Using High-Quality Deterministic Test Patterns


The amount of electronic content in passenger cars is growing rapidly, primarily due to the integration of advanced safety features. The shift towards fully autonomous vehicles, which must comply with stringent safety standards, will further increase the number of electronic components required. Testing efforts must be of exceptional quality. The target test time is often limited to less than 1... » read more

The Challenges Of Testing Automotive Chips


For as long as semiconductor devices have been around, motor vehicles have been one of the toughest operating environments. Chips in automobiles, trucks, and buses are subject to extremes of temperature, humidity, vibration, and radiation. The challenges of designing for these environmental conditions have grown more pronounced with advanced technology nodes, which are necessary to satisfy mark... » read more

The Data Dilemma In Semiconductor Testing And Why It Matters: Part 1


In today’s semiconductor industry, machine learning (ML) is no longer a buzzword — it’s an operational necessity. From optimizing test flows to identifying device drifts and executing advanced analytics like VMIN or trimming, ML-based applications are increasingly used to boost yields, improve quality, and lower test costs. But there’s a catch. To make these intelligent applications ... » read more

High-Speed Test IO: Addressing High-Performance Data Transmission And Testing Needs For HPC & AI


By Lakshmi Jain and Wei-Yu Ma The AI and HPC industries are rapidly shifting toward chiplet-based designs to achieve unprecedented levels of performance, as traditional monolithic system-on-chip (SoC) architectures face scaling limitations. This transition is fueled by the rise of heterogeneous integration, which is driving innovation across the semiconductor sector. However, this advancemen... » read more

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