Everything You Need to Know About Wi-Fi 7

By Keysight - 27 Mar, 2024 - Comments: 0

The IEEE 802.11be standard introduces several new features for improving WLAN efficiency, capacity, and coverage. Features such as multi-link operation (MLO) and multiple resource units (multi-RUs) increase the number of configurations and test scenarios to validate a device thoroughly. In addition to physical-layer testing, test engineers must emulate signaling to verify interactions between a... » read more

Why Banks Should Be More Worried About Security

By John Koon - 03 Mar, 2022 - Comments: 1

At about 10:30 a.m. on Friday, Feb. 5, 2016, Jubail Bin-Huda, a joint director of Bangladesh Bank, and a colleague went to pick up the latest Society for Worldwide Interbank Financial Telecommunication (SWIFT) acknowledgement messages from the printer. When they got to the printer, they found nothing had been printed. They restarted the printer manually, but it still didn't work. They had no... » read more

Manufacturing Shifts To AI Of Things

By John Koon - 06 Jan, 2022 - Comments: 0

AI is being infused into the Internet of Things, setting the stage for significant improvements in manufacturing productivity, improved uptime, and reduced costs — regardless of market segment. The traditional approach to improving manufacturing equipment reliability and efficiency is regular scheduled maintenance. While that is an improvement over just fixing or replacing equipment when i... » read more

Massive IoT Interop Fuels Protocol Battle

By Bryon Moyer - 15 Jul, 2021 - Comments: 0

Wireless standards are plentiful, but most are not capable of being scaled to the level of a smart city. As a result, such networks have been built application-by-application using proprietary stacks, often with non-interoperable network layers. That, in turn, has slowed the proliferation of dense wireless connectivity at scale. “In a hyper-connected world, connectivity choices are driv... » read more

Huawei: 5G Is About Capacity, Not Speed

By Ed Sperling - 18 Aug, 2020 - Comments: 3

Paul Scanlan, CTO of the Huawei Carrier Business Group in Huawei Technologies, sat down with Semiconductor Engineering to talk about 5G, which use cases are attractive and why, and how that compares with previous wireless technologies. SE: Where are you seeing 5G, and how do you see this rolling out both for sub-6GHz and millimeter wave? Scanlan: 5G is a platform for transformation. The f... » read more

Power/Performance Bits: Aug. 10

By Jesse Allen - 10 Aug, 2020 - Comments: 0

Flexible electrodes for thin films Researchers from the University of Queensland and ARC Centre of Excellence in Exciton Science (University of Melbourne) developed a material for flexible, recyclable, transparent electrodes that could be used in things like solar panels, touchscreens, and smart windows. Eser Akinoglu of the ARC Centre of Excellence in Exciton Science said, "The performance... » read more

WiFi Evolves For The IoT

By Bryon Moyer - 06 Aug, 2020 - Comments: 0

WiFi is everywhere, and it’s the most prevalent of the communication protocols that use unlicensed spectrum. But as a common protocol for the Internet of Things (IoT), it faces challenges both because of congestion and the amount of energy it consumes. Two new approaches aim to address those concerns. One is to use multiple channels at once. The second involves the new 802.11ah HaLow stand... » read more

Manufacturing Bits: May 5

By Mark LaPedus - 05 May, 2020 - Comments: 0

Spiking neural network radar chip Imec has developed what the R&D organization says is the world’s first chip that processes radar signals using a spiking recurrent neural network. Initially, the chip from Imec is designed for low-power, anti-collision radar systems in drones. Neural networks are used in the field of machine learning. A subset of AI, machine learning utilizes a neu... » read more

Securing The Mobile IoT

By Synopsys - 05 Jun, 2019 - Comments: 0

It’s 2019. Security fears, locked ecosystems, and lack of technology are keeping IoT products within WiFi networks, and not reaching their full potential. As an industry, we must provide IoT solutions that are simple and keep consumers--and their data--secure.The mobile IoT is the next frontier in the connected device market, providing out-of-the-box connectivity with security from silicon... » read more

January ’19 Startup Funding: $100M+ Rounds Abound

By Jeff Dorsch - 30 Jan, 2019 - Comments: 0

Sixteen companies received private funding rounds of $100 million or more during the month of January, with two privately held companies, Infor and Verily Life Sciences, taking in rounds of $1.5 billion and $1 billion, respectively. The market segments represented in the January rounds were varied. Multiple companies using artificial intelligence technology in their offerings and cloud-based... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: WiFi