Packaging Challenges For 2018


The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

The IoT Is Alive And Well


There has been a lot of grumbling lately about the IoT and how it has failed to live up to expectations. But the problem may be less about the success of the IoT than the ability of any group of chipmakers and manufacturers to capitalize on its success. The IoT has been growing steadily since the term was first coined by Kevin Ashton, who began using RFID inside of Procter & Gamble to ma... » read more

Litho Options For Panel Fan-out


Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

Radar Versus LiDAR


Demand is picking up for vision, radar and LiDAR sensors that enable assisted and autonomous driving capabilities in cars, but carmakers are now pushing for some new and demanding requirements from suppliers. The automotive market always has been tough on suppliers. OEMs want smaller, faster and cheaper devices at the same or improved safety levels for both advanced driver-assistance systems... » read more

What’s Up With MEMS?


New sensor technologies, and smarter ways of integrating more intelligence, continue to generate unexpected opportunities in the changing MEMS business. Changes needed for sensors for context awareness If digital assistants are ever going to be really useful, they’ll need some particular sensor capabilities to understand emotion, suggests Lama Nachman, head of Intel’s Anticipatory Compu... » read more

MEMS Market Shifting


The MEMS sector is beginning to look more promising, bolstered by new end-market demand and different packaging options that require more advanced engineering, processes and new materials. All of this points to higher selling prices, which are long overdue in this space. For years, the market for microelectromechanical systems was populated by too many companies vying for too few opportunit... » read more

Light In A Package


Silicon photonics is gaining significant traction inside the data center, but creating a simpler method of packaging the laser with other circuitry remains a stumbling block for cutting costs and using this technology across a wider swath of applications. Progress does appear to be on the horizon, even though exact time frames remain unclear. The advantages of light in communications are wel... » read more

Cheaper Fan-Outs Ahead


Packaging houses continue to ramp up fan-out wafer-level packages in the market, but customers want lower cost fan-out products for a broader range of applications, such as consumer, RF and smartphones. So in R&D, the industry for some time has been developing next-generation fan-out using a panel-level format, a technology that could potentially lower the cost of fan-out. But there are ... » read more

Advanced Packaging Picks Up Steam


The semiconductor industry’s push toward continued miniaturization and increasing complexity is driving wider adoption of system-in-package (SiP) technology. One of the big benefits of [getkc id="199" kc_name="SiP"] is that it allows more features to be squeezed into ever-smaller form factors, such as wearable gadgets and medical implants. So while the individual chips in this package may ... » read more

Challenges For Future Fan-Outs


The fan-out wafer-level packaging market is heating up. At the high end, for example, several packaging houses are developing new fan-out packages that could reach a new milestone and hit or break the magic 1µm line/space barrier. But the technology presents some challenges, as it may require more expensive process flows and equipment like lithography. Fig. 1: Redistribution layers. Source: L... » read more

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