Cloudy Outlook Seen For IC Biz


After a slowdown in the first half of 2019, chipmakers and equipment vendors face a cloudy outlook for the second half of this year, with a possible recovery in 2020. Generally, the semiconductor industry began to see a slowdown starting in mid- to late-2018, which extended into the first half of 2019. During the first half of this year, memory and non-memory vendors were negatively impacted... » read more

MicroLEDs: The Next Revolution In Displays?


Flat-panel display technology is exploding on several fronts as more screens are required for more devices. But one type of display is generating an enormous amount of buzz in the market—microLEDs. Dozens of companies are working on micro-light emitting diodes (microLEDs), a technology that promises to provide better and brighter displays than current solutions in the market. Apple, Facebo... » read more

Inspecting IC Packages Using Die Sorters


The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools in the in-line production flow, but it also now requires new die sorting equipment with advanced inspection capabilities. Die sorters are not the kind of equipment that typically attracts attenti... » read more

Lithography Challenges For Fan-out


Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools. The latest high-density fan-out packages are migrating toward the 1µm line/space barrier and beyond, which is considered a milestone in the industry. At these critical dimensions (CDs), fan-outs will provide better per... » read more

VCSEL Technology Takes Off


By Kevin Fogarty and Ed Sperling Vertical cavity surface emitting laser (VCSEL) technology, a proven but mostly niche technology until recently, is suddenly a very hot commodity thanks to the introduction of facial recognition in phones and other mobile devices. VCELS primarily have been used as a low-cost way of tracking movement and transfering data in computer mice, laser printers and ... » read more

More 2.5D/3D, Fan-Out Packages Ahead


A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

Week in Review: IoT, Security, Auto


Internet of Things Automotive, health care, manufacturing, and the public sector could be transformed this year by Internet of Things technology, Bob Violino writes. Taqee Khaled, director of strategy at Nerdery, a digital business consultancy, predicts 2019 will see rapid evolution in enterprise IoT pilot initiatives and implementations. "This acceleration is due, in part, to advances in manu... » read more

Packaging Biz Faces Challenges in 2019


The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

Panel Fan-out Ramps, Challenges Remain


After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors. However, panel-level fan-out, which is an advanced form of today’s fan-out packaging, still faces several technical and cost challenges to bring this technology into the mainstream or high-volume manufacturing. Moreover, several companies are d... » read more

DARPA Seeks To Engage With MEMS Industry


Napa, Calif. — DARPA is looking for a few good members of the MEMS industry to offer advice and help to the agency’s Rapid Innovation for Production MEMS (RIPM) concept. Ronald Polcawich, a program manager for the Defense Advanced Research Projects Agency’s Microsystems Technology Office, presented the keynote address on the second and final day of the 2018 MEMS & Sensors Executive... » read more

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