Progress And Chaos On Road To Autonomy


Progress in the development of fully autonomous vehicles is incremental and slow, but not for lack of effort. Research and development in self-driving cars is under way all around the globe, from the biggest automotive manufacturers and their Tier 1 suppliers to companies not traditionally involved in the automotive industry. Add to that fleets of startups working on sensor technologies and ... » read more

Embedded Die Packaging Emerges


Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture in the arena, which is beginning to ramp up production. Additional... » read more

The Week In Review: Manufacturing


Chipmakers 3D NAND continues to gain steam, but is the industry headed towards a capacity glut in the overall NAND market? Time will tell. In any case, Toshiba is moving forward with its plans to invest in its Fab 6 facility in Japan. The fab will produce the company’s 96-layer 3D NAND devices. Then, Samsung plans to invest $7 billion to double the production capacity for NAND flash memor... » read more

LiDAR Goes Back To The Future


LiDAR is emerging as an increasingly important piece of the enabling technology in autonomous driving, along with advanced computer vision and radar sensor chips. But LiDAR systems also are finding their way into a variety of other applications, such as industrial automation, including robotics, and unmanned aerial vehicles. Advanced mapping is another rapidly growing market for LiDAR, which... » read more

Toward High-End Fan-Outs


Foundries and OSATs are working on more advanced fan-outs, including some with vertically stacked die inside the package, filling a middle ground between lower-cost fan-outs and systems in package on one side and 2.5D and 3D-ICs on the other. These new [getkc id="202" kc_name="fan-outs"] have denser interconnects than previous iterations, and in some cases they include multiple routing layer... » read more

Ayar Labs: Faster I/O


Startup AyarLabs is using a combination of high-bandwidth fiberoptics, low-cost CMOS fabrication and careful target selection to strike efficiently at the datacenter's worst bottleneck. "Moore's Law only covers the processor, not how we move data in and out of it during processing or how to get the processor and memory working at the same speed," according to Alexandra Wright-Gladstein, co-f... » read more

Fan-Out Wars Begin


Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, STATS ChipPAC and others sell traditional low-density fan-out packages, although some new and competitive technologies are beginning to appear in the market. Low-density fan-out, or sometimes cal... » read more

Packaging Challenges For 2018


The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

The IoT Is Alive And Well


There has been a lot of grumbling lately about the IoT and how it has failed to live up to expectations. But the problem may be less about the success of the IoT than the ability of any group of chipmakers and manufacturers to capitalize on its success. The IoT has been growing steadily since the term was first coined by Kevin Ashton, who began using RFID inside of Procter & Gamble to ma... » read more

Litho Options For Panel Fan-out


Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

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