Transferable Hybrid Bonding Technique That Allows For High Integration Density In Advanced Packaging

Hierarchical multi-layer stacking with Cu/polymer with tailored transferrable hybrid bonding.

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A technical paper titled “Hierarchical Multi-Layer and Stacking Vias with Novel Structure by Transferrable Cu/Polymer Hybrid Bonding for High Speed Digital Applications” was published by researchers at Industrial Technology Research Institute (ITRI) and Brewer Science.

The paper demonstrates a “novel structure with hierarchical multi-layer stacking vias as well as transferred hybrid bonding, designed and fabricated for tailored AI and high-speed digital applications.”

Find the technical paper here. June 2025.

Citation: O. -H. Lee et al., “Hierarchical Multi-Layer and Stacking Vias with Novel Structure by Transferrable Cu/Polymer Hybrid Bonding for High Speed Digital Applications,” 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, TX, USA, 2025, pp. 313-317, doi: 10.1109/ECTC51687.2025.00059.



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