Supports higher throughput, reduced cycle time, and lower cost per package, while enabling integration of increasingly complex multi-die architectures.
This shift to panel-level packaging addresses critical industry challenges, including rising interposer sizes and declining wafer-level efficiency. The larger panel format supports higher throughput, reduced cycle time, and lower cost per package, while enabling integration of increasingly complex multi-die architectures. These benefits are especially impactful for AI data center and HPC applications, where demand for larger package sizes and higher I/O density continues to accelerate.
The panel-level platform delivers higher throughput through large-area processing and reduced tool change steps, while offering a flexible foundation for heterogeneous integration and system-in-package (SiP) solutions. It supports a wide range of applications including AI, HPC, networking, high-end gaming, and edge AI, helping customers meet performance targets with greater cost efficiency and faster time-to-market.
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