PCIe 6.0, NVMe, And Emerging Form Factors For Storage Applications


PCIe 6.0 implementations are expandable and hierarchical with embedded switches or switch chips, allowing one root port to interface with multiple endpoints (such as storage devices, Ethernet cards, and display drivers). While the introduction of PCIe 6.0 at 64GT/s helped to increase the bandwidth available for storage applications with minimal or no increase in latency, the lack of coherency s... » read more

Building The Metaverse, Part One: The Vision


The longer-term vision of the metaverse is a universe where a massive computer-generated virtual world – or worlds – will be deeply intertwined with the physical world. This will enable humans and things to interact, transact, and collaborate in parallel or in superposition in ways that will mesh real-world activity and simulation in various and increasing indistinguishable ways. The met... » read more

Designing Immersive AR/VR Displays


Last month, we looked at how VESA (Video Electronics Standards Association) video compression codecs enable cutting-edge displays. Over the next couple of articles, we will take a closer look at some of the markets where VESA DSC (Display Stream Compression) and VDC-M (VESA Display Compression) compression offer significant benefits for designers working on display-based applications. Demand... » read more

Data Integrity For JEDEC DRAM Memories


With the DRAM fabrication advancing from 1x to 1y to 1z and further to 1a, 1b, and 1c nodes along with the DRAM device speeds going up to 8533 for LPDDR5 and 8800 for DDR5, data integrity is becoming a really important issue that the OEMs and other users have to consider as part of the system that relies on the correctness of data being stored in the DRAMs for system to work as designed. I... » read more

Thermal Cycling Failure In Electronics


Each time a device is turned off and on, its temperature changes. (Just think about how often your phone lights up all day.) Energy flowing through several layers of tightly stacked materials causes devices to heat up, then rapidly cool down. This repeated oscillation between temperatures over the lifetime of a device is called thermal cycling. Why thermal management is important Thermal cycl... » read more

Electromagnetic Simulation And 3D-IC Interposers


By Matt Commens, Juliano Mologni, and Pete Gasperini Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory (DRAM) deployments that appeared on the market a decade ago, 3D-IC has since expanded its reach. It is now decisively beginning to achieve the... » read more

Active Learning: Integrating Natural Intelligence Into Artificial Intelligence


Today, very few people would likely deny the fact that data can present major added value for companies. But analyzing data from production processes reveals the incompleteness of data collection and the associated reduced potential of the data that can be leveraged. Typical shortcomings include: Incomplete representation of processes in the dataspace, Inadequate connection of processes... » read more

Emulation-Centric Power Analysis Of SoC Designs


Verification expert Lauro Rizzatti recently interviewed Jean-Marie Brunet, senior marketing director, Scalable Verification Solutions Division (SVSD), Siemens EDA, about the importance of accurate power estimation and optimization for system-on-chip (SoC) designs. What is the problem facing the semiconductor industry today regarding pre-silicon power estimation? The problem is the discrep... » read more

Video Compression Enables Cutting-Edge Displays


Display technology has advanced in leaps and bounds. We can now create professional-quality video content on our mobiles, and our cars often have more displays than our living room. In recent years, electronics manufacturers have been using increasingly sophisticated display feature sets as a way of differentiating their products in the highly competitive consumer electronics market. Each new g... » read more

Bringing RFIC Design And Verification Into The Modern Era


For decades, developers of radio frequency (RF) chips and other analog/mixed-signal (AMS) integrated circuits (ICs) have used traditional techniques for design and verification. Most RFIC designers have continued to hand-craft active and passive devices, manually place and route their circuits, and rely on the bring-up lab to validate their pre-silicon SPICE simulations. It is often said that a... » read more

← Older posts Newer posts →