category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Dec, 2018 - Comments: 2

Intel Mark Bohr, a senior fellow and director of process architecture and integration at Intel, is retiring, according to the company. Bohr, who will retire at the end of February 2019, held various technology positions during his 41-year career at Intel. Here is a quick bio on Bohr. Others have also recently retired from Intel’s manufacturing unit amid a massive reorganization in the depart... » read more

Correlation Study of Actual Temperature Profile and In-line Metrology Measurements for Within-Wafer Uniformity Improvement and Wafer Edge Yield Enhancement
By KLA - 14 Dec, 2018 - Comments: 0

Authors: Fang Fang (a), Alok Vaid (a), Alina Vinslava (a), Richard Casselberry (a), Shailendra Mishra (a), Dhairya Dixit (a), Padraig Timoney (a), Dinh Chu (b), Candice Porter (b), Da Song (b), Zhou Ren (b) Key: (a) GLOBALFOUNDRIES, 400 Stone Break Extension, Malta, NY 12020; (b) KLA-Tencor Corporation, One Technology Drive, Milpitas, CA 95035   ABSTRACT With advances in new techn... » read more

Tech Brief: Elements of Electroplating
By Lam Research - 14 Dec, 2018 - Comments: 0

Electroplating is a common manufacturing process that applies a thin layer of one metal onto another. The U.S. penny, for example, has been made of zinc with a thin, electroplated coating of copper since 1982. Jewelry and flatware are also frequently electroplated to improve visual appearance or provide wear and corrosion resistance. Today, electroplating is widely performed in the electronics ... » read more

2018 eBeam Initiative Perceptions Survey Results
By eBeam Initiative - 14 Dec, 2018 - Comments: 0

EUV confidence and multi-beam remains high in the 7th Annual Perceptions Survey – 2018 (July). EUV perceptions remain positive. 82% of respondents predict EUV in HVM by end of 2021. Only 1% predict EUV will never happen. Confidence is high again for EUV lithography in high-volume manufacturing and expectations continue to grow around actinic mask inspection for EUV. Perceptions on the nee... » read more

N7 FinFET Self-Aligned Quadruple Patterning Modeling
By Coventor - 14 Dec, 2018 - Comments: 0

Authors: Sylvain Baudot, Sofiane Guissi, Alexey P. Milenin, Joseph Ervin, Tom Schram (IMEC and COVENTOR) In this paper, we model fin pitch walk based on a process flow simulation using the Coventor SEMulator3D virtual platform. A taper angle of the fin core is introduced into the model to provide good agreement with silicon data. The impact on various Self-Aligned Quadruple Patterning proces... » read more

Industry 4.0 Reaches Into the Subfab
By Applied Materials - 14 Dec, 2018 - Comments: 0

To unlock the full potential of their manufacturing systems and personnel, companies in many industries are rapidly moving toward highly automated systems and digital data-driven methods and tools. Widely known as “smart manufacturing” or Industry 4.0, the resulting productivity improvements are often so dramatic that many people are calling this shift a new industrial revolution. The se... » read more

Smart Manufacturing
By Ed Sperling - 12 Dec, 2018 - Comments: 0

Tom Salmon, vice president of collaborative technology platforms at SEMI, talks about smart manufacturing, and the role of AI, smart gateways, and digital twins. https://youtu.be/e9DQ_Xfc2K0     See other tech talk videos here.   » read more

Manufacturing Bits: Dec. 11
By Mark LaPedus - 11 Dec, 2018 - Comments: 0

FinFET vs. FD-SOI pH sensors At the recent 2018 IEEE International Electron Devices Meeting (IEDM), TSMC and National Tsing Hua University presented a paper on an ion detector or pH sensor based on a 16nm finFET technology. Researchers have developed an advanced version of an ion-sensitive field-effect transistor (ISFET). Originally developed in the 1970s, ISFETs are pH sensors that are use... » read more

Packaging Biz Faces Challenges in 2019
By Mark LaPedus - 10 Dec, 2018 - Comments: 0

The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

Where Advanced Packaging Makes Sense
By Ed Sperling - 10 Dec, 2018 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

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