Chip Industry Week in Review


Samsung and SK hynix joined OpenAI's Stargate initiative to ensure there will be enough memory chips to meet the needs of AI data centers. The goal is to produce up to 900,000 DRAM wafer starts per month. OpenAI also inked agreements to explore the development of next-gen data centers in Korea. Axcelis Technologies (ion implantation systems) will merge with Veeco Instruments (compound semic... » read more

Blog Review: Oct. 1


Synopsys' Chun-Soo Kim and Hoseong Kim suggest making the entire design flow local layout effect-aware to identify and address issues early and ultimately improve PPA by avoiding overly pessimistic designs. Siemens' Kirk Fabbri explores the power distribution network, focusing on power plane capacitance and how it varies with the dynamic switching characteristics of the load and dielectric c... » read more

Chip Industry Week In Review


U.S. Trade Representative Jamieson Greer warned Southeast Asian semiconductor manufacturers that they must shift production to the U.S. or face new punitive tariffs, reports the South China Morning Post. President Trump previously floated a 100% tariff on imported chips. Malaysia and other regional economies are offering large concessions and promises of U.S. goods purchases in hopes of securin... » read more

Blog Review: Sept. 24


Siemens' Harry Foster warns of a big drop in first-time silicon success as more system companies tackle developing their own chip without the accumulated knowledge around flows, sign-off criteria, and coverage closure in a landscape where even small oversights in methodology can lead to multimillion-dollar respins. Synopsys' Godwin Maben warns that skyrocketing power consumption is a critica... » read more

Chip Industry Week in Review


Amkor, TSMC, and Cadence partnered with Tesoro VC, which will serve as the lead operator of a new Global AI + Semiconductor Startup Hub and a Global Design Center in Phoenix, Arizona, aimed at chip innovation, startup growth, and advanced manufacturing. Nvidia will invest $5 billion in Intel common stock at a purchase price of $23.28 per share and the companies will collaborate on AI infrastru... » read more

Blog Review: Sept. 17


Siemens' John McMillan explores the fundamentals of IC package thermal resistance, modeling strategies, and why die-level thermal analysis in 3D-ICs is increasingly essential for ensuring device reliability. Cadence's Jasmine Makhija provides an overview of the TEE Device Interface Security Protocol (TDISP), which helps safeguard PCIe devices within Trusted Execution Environments by providin... » read more

Chip Industry Week in Review


The U.S. is considering annual approvals for Samsung and SK hynix to export chipmaking tools and materials to their factories in China, replacing perpetual waivers granted under the validated end user system, reports Bloomberg. The proposal, presented by the U.S. Commerce Department to South Korean officials, would require the companies to reapply each year for specific quantities of restricted... » read more

Inside Chips Podcast: Data Movement In The AI Age


AI is all about data movement — lots of it. The key is to move data as little as possible, and when it is moved, to do it efficiently, securely, and blindingly fast. Semiconductor Engineering talks with Arteris CEO Charlie Janac in this one-on-one discussion about the impact of AI on networks on chip and what will change going forward. To listen to the podcast, click here. » read more

Blog Review: Sept. 10


Cadence's Satish Kumar C explains Port-Based Routing, a feature in in CXL 3.0 and 3.1 that changes how CXL switches operate within a CXL fabric to enable the creation of much larger, more flexible, and more efficient topologies. Siemens' Bill Hargin demystifies copper foil thickness and weight measurements and why being precise has an impact on signal integrity and crosstalk simulations.... » read more

Chip Industry Week in Review


Cadence plans to buy Hexagon AB's design and engineering business to accelerate expansion in physical AI and system design and analysis. Cadence will pay ~US$3.1 billion in cash and issue stock, with the deal expected to close in early 2026. PWC issued a 104-page in-depth analysis of semiconductor technology and markets, highlighting a broad swath of changes: $1T in annual revenue by 2030, ... » read more

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