Blog Review: September 3


Cadence's Sriram Sharma Kalluri compares convolutional neural networks (CNNs) and transformers to show how their different architectures give them particular strengths and why the choice between them depends on the specific task, the available data, and the computational resources. Siemens' John McMillan provides a primer on the major IC package types, how they influence system design, therm... » read more

Chip Industry Week in Review


Microsoft, OpenAI, and NVIDIA warned about power swings and physical damage to power grids increasing from AI training workloads and jointly proposed a multi-pronged approach to stabilize power in AI training data centers. Meanwhile, Anthropic issued a warning about the weaponization of agentic AI in a new 25-page Threat Intelligence report. Key concerns involve the evolution in AI-assisted ... » read more

Blog Review: August 27


Cadence's Pamula Sai Srinivas explains why clock tree synthesis is essential to ensuring that the clock signal is distributed in a way that helps achieve timing closure and maintain synchronization, performance, and reliability. Synopsys' Sajani Patel, Varun Agrawal, and Manuel Mota check out what's new in UCIe 3.0, including doubling the maximum data rate to 64 GT/s, runtime recalibration, ... » read more

Chip Industry Week In Review


The EU’s tariffs on semiconductors will not exceed 15%, according to Trump’s latest trade deal. In addition, the EU committed to purchasing at least $40 billion worth of U.S. AI chips as well as other investments. [FAQ is here.] Lifelines for Intel: Intel inked a deal to sell the U.S. government a 10% non-voting equity stake in its business, worth $8.9 billion. The stake will be fun... » read more

Blog Review: August 20


Cadence's Sriram Sharma Kalluri finds that time-of-flight sensors are poised to revolutionize ADAS by generating precise 3D point clouds that, particularly when combined with lidar, contribute to an exceptionally accurate and comprehensive understanding of the vehicle's surroundings. Synopsys' Igor Markov and other industry experts discuss how quantum computing is moving from research to p... » read more

Chip Industry Week in Review


Lines are blurring between government and industry: On the heels of last week's resignation demand, Intel CEO Lip-Bu Tan met with President Trump on Monday, with the President later saying, "The meeting was a very interesting one. His success and rise is an amazing story."  Now, Bloomberg reports the Trump administration is in talks with Intel for the U.S. government to take a stake in th... » read more

Chip Industry Week in Review


Apple plans to increase its U.S. investment by an additional $100 billion over four years, which includes the launch of an advanced manufacturing supply chain program, spurring a number of related chip industry announcements, including: Apple will invest in Amkor's new packaging and test facility in Arizona as its first and largest customer, and Amkor will package and test Apple silicon pr... » read more

Blog Review: Aug. 6


Cadence's Shyam Sharma checks out key features of the LPDDR6 specification, including data transfer speeds that can reach up to 14.4Gbps, two sub-channels per device, metadata built into the data packets, and row hammer mitigation. Synopsys' Frank Malloy and Vincent van der Leest describe the essential role that a hardware root of trust plays in providing a secure foundation for all other se... » read more

Chip Industry Week in Review


The U.S. government announced new import tariff actions and deals this week, including: The EU: 15% tariff on most goods including semiconductors. According to the EU's president, the action excludes semiconductor equipment. Copper: 50% tariff on all imports of semi-finished copper products and intensive copper derivative products, effective Aug. 1, but raw input material is excluded. ... » read more

Blog Review: July 30


Siemens' John McMillan compares 2.5D and 3D-IC technologies and why choosing between them depends on the specific requirements of a product, such as power consumption, thermal constraints, form factor limitations, data bandwidth, and performance-per-watt targets. Cadence's Yeshavanth BN checks out changes in MIPI MPHY 6.0 that increase the data rate and improve the performance of next-genera... » read more

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