category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Advanced Packaging’s Progress
By Mark LaPedus - 09 Oct, 2017 - Comments: 0

Shim Il Kwon, CTO at STATS ChipPAC, sat down with Semiconductor Engineering to discuss the current and future trends of chip packaging. What follows are excerpts of that conversation. SE: The outsourced semiconductor assembly and test (OSAT) vendors provide third-party IC-packaging and test services. What are the big challenges for OSATs today? Shim: The OSAT market is very competitive, w... » read more

Plugging Gaps In Advanced Packaging
By Ann Mutschler - 27 Sep, 2017 - Comments: 0

The growing difficulty of cramming more features into an SoC is driving the entire chip industry to consider new packaging options, whether that is a more complex, integrated SoC or some type of advanced packaging that includes multiple chips. Most of the work done in this area so far has been highly customized. But as advanced packaging heads into the mainstream, gaps are beginning to appea... » read more

Light In A Package
By Ed Sperling - 18 Sep, 2017 - Comments: 1

Silicon photonics is gaining significant traction inside the data center, but creating a simpler method of packaging the laser with other circuitry remains a stumbling block for cutting costs and using this technology across a wider swath of applications. Progress does appear to be on the horizon, even though exact time frames remain unclear. The advantages of light in communications are wel... » read more

Systems Of Packages
By Ed Sperling - 11 Sep, 2017 - Comments: 0

The shift from IP blocks to subsystems, with pre-integrated and pre-verified IP, has never lived up to the initial hype. That doesn't mean the concept isn't valid, though. The problem with subsystems, as originally conceived, is they were far too limited for widespread adoption. When this idea first began surfacing in the early pat of the Millennium, this all made sense because the number o... » read more

Advanced Packaging For Automotive Dashboard Application
By STATS ChipPAC - 11 Sep, 2017 - Comments: 0

The current automotive market for the IC (integrated circuit) packaging industry has grown significantly due to the increasing need for automation and higher performance in vehicles. These changes in the automotive market will enable cars to be more reliable and intelligent. To address the increasingly complex demands of the automotive market, the semiconductor packaging industry is shifting it... » read more

Fusing CMOS IC And MEMS Design For IoT Edge Devices
By Mentor, a Siemens Business - 11 Sep, 2017 - Comments: 0

Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved (Analog, digital, RF, and MEMS). But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a MEMS sensor on the same silicon die can seem impossible. In fact, many IoT edge devices combine multiple dies in a single package, separating electronics from the M... » read more

Get Ready For In-Mold Electronics
By Jeff Dorsch - 11 Sep, 2017 - Comments: 1

Imagine inserting the electronics into a product without using a printed circuit board, a module, or even a system-in-package. That's the promise of in-mold electronics (IME), a technology that has been around for years, but which is just beginning to see wider adoption. The technology is related to conductive inks and transparent conductive films. The IME manufacturing process is said to pr... » read more

How To Make Autonomous Vehicles Reliable
By Ann Mutschler - 11 Sep, 2017 - Comments: 1

The number of unknowns in automotive chips, subsystems and entire vehicles is growing as higher levels of driver assistance are deployed, sparking new concerns and approaches about how to improve reliability of these systems. Advanced Driver Assistance Systems (ADAS) will need to detect objects, animals and people, and they will be used for parking assistance, night vision and collision avoi... » read more

Inside Panel-Level Fan-Out Technology
By Mark LaPedus - 11 Sep, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss panel-level fan-out packaging technology with Tanja Braun, deputy group manager at the Fraunhofer Institute for Reliability and Microintegration IZM, and Michael Töpper, business development manager at Fraunhofer IZM. Braun is responsible for the Panel Level Packaging Consortium at Fraunhofer IZM, as well as the group manager for assembly and encap... » read more

Astronics Ballard Technology OmniBus II PXI Express Product for Avionics Test
By NI - 11 Sep, 2017 - Comments: 0

The OmniBus II PXIe databus interface products combine the standard PXIe interface with MIL-STD-1553 and ARINC 429 Avionics Data Bus interfaces. Interface cards can be ordered with either MIL-STD-1553 only, ARINC 429 only, or both interfaces on the same card. The PXIe interface includes a PCIe x1 interface to the controller as well as support for PXI clock, timing and trigger signals. The inclu... » read more

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