category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

The Chiplet Option
By Ed Sperling - 09 Oct, 2017 - Comments: 0

All of the leading chipmakers, foundries and OSATs are now working with some sort of advanced packaging. The next step is to add some consistency to those efforts to be able to assemble chips much more quickly and inexpensively. DARPA has been promoting chiplets as the best way to solve this problem, and for the military, this is a pretty logical choice. With a push toward heterogeneity in c... » read more

The 2017 International Test Conference
By Jeff Dorsch - 09 Oct, 2017 - Comments: 0

Machine learning is a hot topic at many technical conferences this year. It will be true at the upcoming International Test Conference, which opens near the end of this month in Fort Worth, Texas. On Sunday, October 29, there are two tutorials devoted to machine learning. Monday, October 30, will have one tutorial related to the topic. The conference gets fully under way on Halloween, wit... » read more

Toward System-Level Test
By Ed Sperling - 09 Oct, 2017 - Comments: 0

The push toward more complex integration in chips, advanced packaging, and the use of those chips for new applications is turning the test world upside down. Most people think of test as a single operation that is performed during manufacturing. In reality it is a portfolio of separate operations, and the number of tests required is growing as designs become more heterogeneous and as they ar... » read more

Reliability Of eWLB For Automotive Radar Applications
By STATS ChipPAC - 09 Oct, 2017 - Comments: 0

With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as Ball Grid Array (BGA) with flipchip or wirebonding. With the advancement of various fan-out (FO) WLPs, it has been proven to be a more optimal, low cost, integrated and reliable solution compared to ... » read more

Is It Safe To Assume That All “Passed” Die Are Actually “Good” Die?
By Guy Cortez - 09 Oct, 2017 - Comments: 0

In a world where Quality and Brand Protection is King, as certainly is the case for the automotive and medical device industries where strict minimal DPPM (defective parts per million) requirements are a common constraint, new methods for “escape” prevention and outlier detection are constantly being evaluated and implemented by semiconductor vendors to prevent any defective or marginal par... » read more

Integrated Passives Market Gets Active
By Jeff Dorsch - 09 Oct, 2017 - Comments: 0

Integrated passive devices are seeing greater use within system-in-package technology and numerous applications, including the Internet of Things. The tiny devices are making their way into automotive electronics, consumer electronics, and health-care products, among other uses. Europe is leading the way in supplying IPDs, thanks to offerings from Infineon Technologies, STMicroelectronics, a... » read more

The Future Of Human/Machine Interaction Is Personal
By Judy Davies - 09 Oct, 2017 - Comments: 0

What comes to mind when you think of a human/machine interface? Something close at hand like your smartphone’s GPS and the ATMs at your bank? Something futuristic like flying cars and jetpacks? Something dangerous like menacing cyborgs? As technology becomes more pervasive in our everyday activities, there are a growing number of human/machine interfaces. They also are becoming more personal.... » read more

True Costs Of Process Node Migration
By Mentor, a Siemens Business - 09 Oct, 2017 - Comments: 0

Deciding when and how to make a process node transition is critical to business success. The solution that requires the least amount of total change—in the form of license configurations, required hardware resources, necessary tool qualifications, and adequate support infrastructure—will always be the most “inexpensive” option. Do you have all the information you need to make the right ... » read more

Tips For Research Grants
By Igor Alvarado - 09 Oct, 2017 - Comments: 0

One of the challenges in academic research is to find ways to accelerate innovation and bring new technologies to market faster for broader use and for benefiting society. In fact, only a small fraction of the research performed in academic institutions successfully leaves the labs and reaches the marketplace. Some of the known causes for this include product-market mismatch, limited funding, a... » read more

Thunderbolt 3 Remote Control Of PXI Test Systems
By NI - 09 Oct, 2017 - Comments: 0

The new PXIe-8301 remote control module is the industry’s first solution for laptop control of PXI systems using Thunderbolt 3 technology. With its contemporary connectivity and low cost, the PXIe-8301 makes high-performance control of PXI systems more accessible and affordable to engineers performing benchtop characterization and validation or developing portable automated test systems. T... » read more

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