category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Chip-Package-Board Issues Grow
By Ann Mutschler - 06 Feb, 2017 - Comments: 0

As systems migrate from a single die in a single package on a board, to multiple dies with multiple packaging options and multiple PCB form factors, it is becoming critical to move system planning, assembly, and optimization much earlier in the design-through-manufacturing flow. This is easier said than done. Multiple tools and operating systems are now used at each phase of the flow, partic... » read more

Digital States, Voltage Levels, And Logic Families
By NI - 06 Feb, 2017 - Comments: 0

Learn about digital states, voltage logic levels, and logic level families for digital signals. This tutorial is part of the Instrument Fundamentals series. To read more, click here. » read more

Betting On Wafer-Level Fan-Outs
By Ed Sperling - 06 Feb, 2017 - Comments: 2

Advanced packaging is starting to gain traction as a commercially viable business model rather than just one more possible option, propelled by the technical difficulties in routing signals at 10nm and 7nm and skyrocketing costs of device scaling on a single die. The inclusion of a [getkc id="202" kc_name="fan-out"] package for logic in Apple's iPhone 7, based on TSMC's Integrated Fan-Out (... » read more

ATO 2017: Driven by Necessity
By James Truchard - 06 Feb, 2017 - Comments: 0

In the aerospace and defense industry, reducing release cycles and preventing program delays have become increasingly difficult. In automotive, consumer demands are driving up test complexity and introducing new costs in areas like infotainment. In response, test managers must find affordable ways to incorporate RF testing for wireless signals and machine vision testing for assisted parking to ... » read more

Logic Analyzers Never Die
By Jeff Dorsch - 06 Feb, 2017 - Comments: 0

Logic analyzers, long a mainstay of chip design, are finding new demand for IoT devices—and frequently in different forms than in the past. Once associated with big, bulky benchtop instruments, this technology has evolved significantly over the past 40 years. In some cases it has been moved into software, where the measurement results are more likely to be viewed upon a laptop screen or a ... » read more

What’s Missing In Advanced Packaging
By Ann Mutschler - 22 Dec, 2016 - Comments: 0

Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

Morphing Moore’s Law
By Ed Sperling - 15 Dec, 2016 - Comments: 0

In 1965, Gordon Moore defined a timetable for doubling the number of transistors on a piece of silicon every two years. The law, as he originally defined it, is now hopelessly outdated. Any attempts to apply it to the most advanced chips today are a stretch at best, and complete fiction at worst. No one is on a two-year cadence between process nodes anymore—not even Intel. In fact, no one ... » read more

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design
By David Vye - 17 Nov, 2016 - Comments: 0

We are entering the third phase of information connectivity, one that will change the use of wireless technology dramatically. The first phase connected homes and businesses through wired telephony and the early internet via dial-up modems. Over the last few decades, the development of communication networks has been superseded by wireless mobile technology connecting people instead of places. ... » read more

Making 2.5D, Fan-Outs Cheaper
By Ed Sperling - 17 Nov, 2016 - Comments: 2

Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

Testing the Big Bang of Smart Devices
By NI - 19 Oct, 2016 - Comments: 0

Thanks to the proliferation of smart devices in the Internet of Things (IoT), it’s a circumstance not unlike the overwhelming sense of wonder and bewilderment that ancient Greek astronomer Ptolemy must have felt when gazing up at a sky full of stars on a clear winter’s night, trying to rationalize the vast tableau before him. But just as we wouldn’t critique early astronomers and philo... » read more

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