IC Security Threats Spike With Quantum, AI, And Automotive


Key Takeaways: The top challenge for the chip architect is building post‑quantum cryptography securely into real hardware from the start, not just selecting approved algorithms. Security must be treated as a core silicon architecture decision early on, especially for long‑lived, automotive, and multi‑vendor systems. Automotive cybersecurity now requires a holistic approach span... » read more

The One Bit Problem That Can Break a System


Key Takeaways: Bit flipping is no longer a rare reliability issue but a systemic risk driven by shrinking process nodes, higher clock speeds, lower voltages, and radiation exposure, leading to silent data corruption and potential system failure. The same mechanisms that cause accidental bit flips can be deliberately exploited through techniques such as clock, voltage, laser, and rowhamm... » read more

Embedded World 2026: Bringing Edge AI Into The Real World


Embedded World 2026 made one thing clear: AI is no longer confined to the cloud—it’s moving decisively onto the device. Across our demos and conversations, a consistent theme emerged: intelligence is shifting closer to where data is created—into devices, environments, and the physical world. From smart homes to industrial systems and a wide range of emerging robotics applications, the ... » read more

Secure at First Silicon: Reducing Cost and Risk


Security weaknesses related to side-channel leakage are often discovered far too late in the lifecycle of a chip. Design teams may focus on functionality, performance, and power, assuming that a robust algorithm like AES is enough to guarantee security. Only after first silicon comes back – and an expert lab starts probing power traces or EM emissions – do they realize that sensitive inform... » read more

Enabling Physical AI and Robotics: Platform for the Intelligent Edge


Physical AI has emerged as an essential technology driving the future of robotics — it closes the loop between perception, reasoning, and action in the real world using powerfully trained AI models. But for robots and autonomous machines, that loop only works well if it runs where the world is actually sensed: at the Edge. Instead of streaming raw sensor data to a data center for interpretati... » read more

Ensuring Trustworthiness of AI-Enhanced Embedded Systems


Artificial Intelligence (AI) is unlocking new capabilities in safety-critical systems, from enhanced motor control to autonomous driving. However, integrating AI safely remains a significant challenge due to its data-driven nature and operation in open and real-world variability. While established standards such as ISO 26262 and ISO 21448 provide a foundation for functional safety and intended ... » read more

Accelerating Automotive Innovation: SRAM Compiler Breakthroughs for 5nm and 3nm SoCs


Modern automotive SoCs must deliver extreme performance, functional safety, and long‑term reliability — all under growing power and thermal constraints. This white paper explains how next‑generation Synopsys SRAM Compiler IP for TSMC N5A and N3A helps design teams meet these challenges with measurable gains in PPA, reliability, and system robustness. Why Read this White Paper: See... » read more

Hardware Deployment for Secure AI Using Confidential Computing


AI’s fast evolution is producing autonomous systems that can operate with minimal human oversight, improve themselves and become effective at decision-making in complex environments. These developments require careful consideration of security and privacy. To limit the overhead performance impact (area, throughput, latency and power), hardware-based security solutions can be deploye... » read more

Radar SLAM Application on Vision DSPs based on Novel IO-ICP


With the increasing use of vision, radar and LiDAR in autonomous vehicles, robots, drones, and augmented reality, there is a greater demand for the capability and performance of multimodal sensing applications. This demand requires sophisticated multi-sensing algorithms and powerful digital signal processors (DSPs) to run them. Simultaneous localization and mapping (SLAM) has revolutionized ... » read more

Preparing For The Multiphysics Future of 3D ICs


3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, power efficiency and cost, 3D ICs are poised to transform the landscape of electronic devices. However, with 3D ICs come new design and verification challenges that must be addressed to ensure success... » read more

← Older posts Newer posts →