The ABCs Of ISO 26262


Over the last one-and-a-half years that I have been elbow-deep working on the FlexNoC Resilience Package, I’ve been keeping a running list of ISO 26262 abbreviations and acronyms that reoccurred in my work, and kept confusing me whenever I performed a “context switch” from working on different projects to working on my functional safety products. I’ve received feedback that my list is h... » read more

Turning On The Virtual Prototyping Hose


Growing up in Belgium, it never occurred to me that rain—or for that matter water—can be in short supply. Having lived in California for more than eight years, now I know better. While I still enjoy the fantastic weather in the Bay Area, I do realize the importance of having enough rain and water. Water is one of those resources that we easily take for granted. It is, in fact, the most impo... » read more

More Online Technology


Got that family member who is really hard to shop for? Expecting a last-minute rush to the mall to find that unique one-of-a-kind gift? eSilicon has great news for you. Everyone knows that at least half of every chip contains on-board memory and now you can shop for that special someone by browsing eSilicon’s large selection of semiconductor memory IP. We launched the IP MarketPlace envir... » read more

From Specification To Chip: A Holistic Design Approach


Chip design is getting more and more challenging in terms of power, performance, area and IP integration. At the same time, competition and time-to-market are forcing much tighter schedules. The traditional ASIC design approach taken by OEMs is to handle the majority of front-end design in-house, and then hand off either register-transfer level (RTL) code or a netlist to an outside vendor, who ... » read more

High-Performance Network Data-Packet Classification Using Embedded Content-Addressable Memory (TCAMs)


With port speeds exceeding 100Gbps, route lookups that are fundamental to all routers have relied on ternary content addressable memories (TCAMs) to provide a lookup response within a clock cycle. However, TCAMs in discrete form are expensive, consume a lot of power, compete for precious real estate on the printed circuit board (PCB), and in some applications lack required flexibility. Embeddin... » read more

Using VDKs For Automotive Systems Development


The software content of automotive systems found in powertrain, chassis, safety, body and advanced driver assistance systems (ADAS) application is increasing. At the same time, the pressure to accelerate development time lines, improve reliability and maintain/reduce costs is also increasing. Automotive OEM, Tier 1 and semiconductor companies involved in embedded software development, integrati... » read more

FPGA Verification with Assertions: Why Bother?


This paper provides a practical, easy, step-by- step set of instructions on how to add assertions to your RTL design. By following the simple guidelines provided in this paper you will benefit by cutting simulation debugging time in half, as well as finding very complex bugs that are likely to escape traditional simulation without assertions. To read more, click here. » read more

Blog Review: Dec. 17


Ansys' Bill Vandermark unearths the top five engineering articles for this week. Check out the ship-based laser weapon used to destroy drones. There's also a product called The Sphere that allows you to do strange things like answer the phone by tapping on the refrigerator. Bet you didn't think of that one. Cadence's Steve Carlson lists the top five things that can go wrong in mixed signal ... » read more

Enabling ISO 26262 Qualification


This document describes how to approach the software tool qualification outlined in ISO 26262 when developing automotive electrical and electronic systems using Cadence tools. Cadence provides an ISO 26262 Tool Qualification Kit, also described in this document, that can help developers through the process with common use cases and reference workflows. Following these guidelines speeds developm... » read more

System Bits: Dec. 16


High rise chip For decades, the mantra of the semiconductor industry has been ‘smaller, faster, cheaper.’ Stanford researchers are also adding ‘taller’ to the mix, and describing how to build high-rise chips that promise to leapfrog the performance of the single-story logic and memory chips on today's circuit cards. Stanford researchers said their approach would end the ‘logjams�... » read more

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