category: Top Stories

category: Auto, Security & Edge AI

The Changing IP Ecosystem
By Ann Mutschler - 21 Aug, 2014 - Comments: 0

Is a larger [getkc id="43" kc_name="IP"] company better suited to deliver what users need – from hardware to software to PDKs and reference designs – with larger and more diverse teams to draw upon, as well as deep foundry relationships? Or does it pay to small, quick and nimble? The answer to that question appears to be playing out in real time. As design complexity has increased, so ha... » read more

More Than Moore
By Ed Sperling - 21 Aug, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the value of feature shrinks and what comes next with Steve Eplett, design technology and automation manager at Open-Silicon; Patrick Soheili, vice president and general manager of IP Solutions at eSilicon; Brandon Wang, engineering group director at Cadence; John Ferguson, product manager for DRC applications at Mentor Graphics; and Kevin Kranen, d... » read more

IP Subsystems: What Works, What Doesn’t
By Ann Mutschler - 21 Aug, 2014 - Comments: 0

The [getkc id="81" kc_name="SoC"] landscape has changed substantially over the past decade and so have some of the definitions for aspects of the system—particularly the [getkc id="43" kc_name="IP"] subsystem. “We’ve been at the point for some time for large SoCs that what we thought about as a building block 10 years ago is now too small,” said [getperson id="11489" p_name="Drew Win... » read more

Different Approaches Emerge For Stacking Die
By Ed Sperling - 21 Aug, 2014 - Comments: 1

The concept of stacking die to shorten wires, improve performance, and reduce the amount of energy required to drive signals has been in research for at least the past dozen years at both IBM and Intel. And depending upon whom you ask, it could be another 2 to 10 years before it becomes a mainstream packaging approach—if it happens at all. At least part of the confusion stems from how you ... » read more

Executive Insight: Jack Harding
By Ed Sperling - 18 Aug, 2014 - Comments: 0

SE: What’s worrying you these days? Harding: One thing that bothers me is the cost of chip development on a per-chip basis. We seduce ourselves into thinking everything is wonderful because the cost per transistor is dropping in chunks. Gate costs are going down at every node. If you look at the secular trend, we’ve done a pretty good job putting a lot of stuff in a small space. In my bu... » read more

Watching Qubits At Work
By Katherine Derbyshire - 18 Aug, 2014 - Comments: 0

As previously discussed, part of the appeal of qubits based on nitrogen-vacancy (N-V) defect centers in diamond is the ability to manipulate them with light. Light pulses can be used both to initialize the qubit array and to measure the results of quantum computations. As recent work at The University of Chicago shows, light can also be used to study the evolution of the quantum state in the... » read more

Signoff Intensity On The Rise
By The SE Staff - 15 Aug, 2014 - Comments: 2

By Ann Steffora Mutschler and Ed Sperling Lithography and signoff are crossing swords at 16/14nm and 10nm, creating new problems that raise questions about just how confident design teams will be when they sign off before tapeout — and how many respins are likely to follow. While designs at 20nm, 16nm and 14nm typically rely on colorless double patterning, at 10nm colors are mandatory. ... » read more

Ion Implanter Market Heats Up
By Mark LaPedus - 14 Aug, 2014 - Comments: 0

The ion implanter market has been a stable, if not a sleepy, business. The last big event took place in 2011, when Applied Materials re-entered the ion implanter market by acquiring Varian, the world’s leading supplier of these tools. The acquisition gave Applied Materials a commanding 80% share of the implanter business, with the other players fighting for the crumbs. But after year... » read more

DSA: Hype Or Revolution?
By Michael Watts - 14 Aug, 2014 - Comments: 0

Directed self-assembly (DSA) has become the subject of a great deal of research attention in the lithography world, to the point where there were dedicated sessions at this year’s Advanced Lithography conference in February. So is this just another passing research fad, or is it a technology that will revolutionize semiconductor manufacturing? DSA utilizes a block copolymer that effectivel... » read more

More Problems Ahead
By Ed Sperling - 14 Aug, 2014 - Comments: 3

Semiconductor Engineering sat down to discuss future scaling problems with Lars Liebmann, a fellow at IBM; Adam Brand, managing director of transistor technology at Applied Materials; Karim Arabi, vice president of engineering at Qualcomm; and Srinivas Banna, a fellow for advanced technology architecture at GlobalFoundries. SE: We’re starting to hear talk about octuple patterning. We’ve ... » read more

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