category: Top Stories

category: Auto, Security & Edge AI

The Search For The Next Transistor
By Mark LaPedus - 20 Feb, 2014 - Comments: 3

In the near term, the leading-edge chip roadmap looks fairly clear. Chips based on today’s finFETs and planar fully depleted silicon-on-insulator (FDSOI) technologies are expected to scale down to the 10nm node. But then, the CMOS roadmap becomes foggy at 7nm and beyond. The industry has been exploring a number of next-generation transistor candidates, but suddenly, a few technologies are ... » read more

Quantum Computer Race Heats Up
By Mark LaPedus - 20 Feb, 2014 - Comments: 0

For years, there has been an intense race among various nations to develop the world’s fastest supercomputers. The U.S. and Japan led the field until 2010, when China stunned the market and rolled out the world’s fastest supercomputer. And today, China continues to lead the field with a supercomputer capable of running at speeds of 33.86 petaflops per second. While the supercomputer race... » read more

Many Stresses Impact TSVs
By Ann Mutschler - 20 Feb, 2014 - Comments: 0

Too much stress in humans is typically not beneficial, and the same goes for 3D-ICs with through-silicon vias (TSVs). Stress effects here come from the fact that copper, which is the conductor of choice for the TSVs, and silicon have different coefficients of thermal expansion. “If you can imagine that a via will be etched through the silicon, copper will be deposited inside and then t... » read more

Executive Insight: Luc Van den hove
By Mark LaPedus - 20 Feb, 2014 - Comments: 1

Semiconductor Engineering sat down to discuss current and future process technology challenges with Luc Van den hove, president and chief executive of Imec. What follows are excerpts of that conversation. SE: The industry is simultaneously working on several new and expensive technologies. This includes extreme ultraviolet (EUV) lithography and the next-generation 450mm wafer size. The indu... » read more

Interconnect Challenges Grow
By Mark LaPedus - 20 Feb, 2014 - Comments: 0

Qualcomm outlined the technology challenges facing mobile chip suppliers at a recent event. In no particular order, the challenges include the usual suspects—area scaling, power reduction, performance and cost. Another concern for Qualcomm is an often-overlooked part of the equation—the backend-of-the-line (BEOL). In chip production, the BEOL is where the interconnects are formed within ... » read more

Executive Insight: Kathryn Kranen
By Ed Sperling - 17 Feb, 2014 - Comments: 0

Semiconductor Engineering sat down with Kathryn Kranen, president and CEO of Jasper Design Automation, to discuss what's changing in the semiconductor industry, why that's happening, and what to watch out for. The interview is part of an ongoing series of in-depth interviews with top executives from all segments of the industry. SE: What keeps you up at night? Kranen: Figuring out ways to... » read more

Are Processors Running Out Of Steam?
By Ed Sperling - 14 Feb, 2014 - Comments: 4

In 2004, Intel introduced a new line of Pentium chips that ran at 3.6GHz. Fast forward to today, and the company’s i7 processors run at 3.5GHz with a Turbo Boost to 3.9GHz. There have been many improvements in the meantime. There is more cache and dramatically faster access to data stored in that cache. And there are more cores with improved coherency between them. But the big problem is p... » read more

Do Chips Really Work The First Time?
By Brian Bailey - 13 Feb, 2014 - Comments: 3

The industry used to have survey data that showed the number of respins required for a broad swath of designs and the principle causes of those respins. That was a good indicator of where tools or processes needed to be improved. At the time, the data showed that the primary cause of respins was functional errors, and since then EDA vendors have been beefing up tools in that area. Most of th... » read more

SoC Integration Mistakes
By Ed Sperling - 13 Feb, 2014 - Comments: 2

Semiconductor Engineering sat down to discuss integration challenges with Ruggero Castagnetti, distinguished engineer at LSI; Rob Aitken, an ARM fellow; Robert Lefferts, director of engineering in Synopsys’ Solutions Group; Bernard Murphy, chief technology officer at Atrenta; and Luigi Capodieci, R&D fellow at GlobalFoundries. What follows are excerpts of that roundtable discussion. SE... » read more

Power Reduction Through Sequential Optimization
By Ann Mutschler - 13 Feb, 2014 - Comments: 1

Dealing with power is a multifaceted challenge and is an equal-opportunity problem — everybody can contribute to the solution and at many levels of abstraction. At the architectural or system level, fundamental tradeoffs are done and the engineering team decides how much memory the system needs, what type of processor, what performance, area, power, among other things. Some people may use ... » read more

← Older posts Newer posts →

  • Sponsors

  • Standards/Organizations

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy