A new technical paper titled “Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging” was published by researchers at University of Florida.
Abstract
“As hardware security threats escalate across semiconductor manufacturing and advanced packaging, there is a growing need for novel physical mechanisms to counter sophisticated attacks such as tampering, counterfeiting, and supply chain infiltration. This paper presents Nanoelectromechanical Systems (NEMS) as an emerging class of hardware security primitives that enable physical assurance, tamper detection, and authentication at the device level. Leveraging mechanisms such as NEMS-based Physically Unclonable Functions (PUFs), shape memory materials, resonance-based fingerprints, and physical unlocking architectures, these systems offer enhanced resilience to reverse engineering, side-channel attacks, and environmental degradation. By harnessing mechanical unpredictability and fabrication-induced nanoscale variability, NEMS technologies introduce a physically robust and low-power alternative to conventional digital security methods. Their seamless integration into standard semiconductor workflows paves the way for scalable, verifiable, and secure solutions across defense, aerospace, critical infrastructure, and consumer electronics.”
Find the technical paper here. November 2025.
Kottur, Himanandhan Reddy & Arjunamahanthi, Pavanbabu & Khan, Mohammad Shafkat Mahmud & Biswas, Liton & Varshney, Nitin & Asadizanjani, Navid. (2025). Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging. IMAPSource Proceedings. 2025. 10.4071/001c.147187.
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