Power And Sensing – Selection Guide 2026


The semiconductor industry is undergoing a transformation. This transformation is driven by the critical role semiconductors play in decarbonization and digitalization and their ability to enable innovation across fields at an unprecedented scale. Recent advancements in AI, autonomous driving, humanoid robots, and our increasingly connected lifestyles are just a few examples of the rapid change... » read more

The Specialty Device Surge Part 2: The Process Control Challenges Of MEMS, Co-Packaged Optics, And More


In a world where high-bandwidth memory, GPUs, and advanced AI packages are all the rage, it is easy to forget the important role specialty devices play. These unsung heroes of modern life perform critical functions across a wide range of industries, including automotive, telecommunications, data centers, emerging AI hardware ecosystems, and consumer electronics, just like the smartphone in your... » read more

Thermal Characterization For Power Semiconductor Packages (KATECH)


Researchers from Korea Automotive Technology Institute published "Analytical Extraction of Thermal Resistance in Power Semiconductors Using Structural Function Derivatives and Series Resistance Modeling." Abstract "Junction-to-case thermal resistance (RthJC ) is a critical parameter for assessing the reliability and thermal performance of power semiconductor devices. Conventional JEDEC-ba... » read more

Topology Selection For Bidirectional Energy Flow Applications Using WBG Devices


The paper provides an overview of the topology for bidirectional converters and discusses their different usage. Bidirectional energy flow applications are usually found in energy storage systems, battery systems, and can be categorized as grid-connected and DC-DC-connected. In grid-connected applications, two power conversion stages, which are power factor corrector (PFC) rectifier/inverter an... » read more

Research Bits: Sept. 16


Beyond-EUV resists Researchers from Johns Hopkins University, East China University of Science and Technology, École Polytechnique Fédérale de Lausanne (EPFL), Soochow University, Brookhaven National Laboratory, and Lawrence Berkeley National Laboratory propose a combination of new resist materials and a higher-powered EUV process that could enable smaller chip feature sizes. The "beyond... » read more

The Race To Replace Silicon


For over 75 years, silicon has been the dominant material in the evolution of modern electronics, powering everything from smartphones to satellites. But as chipmakers push toward smaller nodes, higher power efficiency, and quantum-scale precision, a pressing question is echoing across fabs and R&D labs worldwide: Is it time to move beyond silicon? In this blog post, we explore the growi... » read more

E-Powertrain EMC Design And Validation


In the pursuit of zero-emission vehicles, the design of the e-powertrain and its electronic systems encounters numerous challenges. From stringent regulatory requirements to the demand for enhanced performance and efficiency, the landscape is ripe with complexities. Here, simulation emerges as a vital tool, offering a pathway to navigate these challenges with precision and innovation. What y... » read more

Overview of Silicon Carbide Technology: Status, Challenges, Key Drivers, and Product Roadmap


Abstract: Arguably, SiC technology is the most rapidly expanding IC manufacturing technology driven mostly by the aggressive roadmap for battery electric vehicle penetration and also industrial high-voltage/high-power applications. This paper provides a comprehensive overview of the state of the art of SiC technology focusing on the challenges starting from the difficult and lengthy SiC substr... » read more

Enhancing AI Datacenter PSUs With Hybrid-Si, SiC, And GaN Power Devices


The rapid growth of artificial intelligence (AI) is driving an unprecedented demand for processing power in data centers, resulting in a surge in power demand at the rack level. With the existing data center rack sizes, the challenge is to deliver more power and efficiency in the same physical footprint apart from costs and cooling. To address this, Infineon has developed a range of hybrid powe... » read more

Electrifying Everything: Power Moves Toward ICs


As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. The next wave of innovation is to bring power control closer to the action — directly on the chip or into a heterogeneous package. This change is driven by a relentless pursuit of efficiency, scala... » read more

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