tag: Synopsys

Blog Review: Sept. 15
By Jesse Allen - 15 Sep, 2021 - Comments: 0

Synopsys' Ian Land and Ricardo Borges examine how radiation modeling can help ensure semiconductor components will survive while housed in equipment that is orbiting our planet or traveling through deep space over extensive periods of time. Siemens EDA's Rich Edelman explores why writing coverage is an art requiring imagination, practice, and patience, along with some tips on how to improve.... » read more

Improving Robustness And Minimizing Over-Pessimism In The Face of Rising Design Variability
By Rahul Deokar - 14 Sep, 2021 - Comments: 0

Part 1 of this blog explored the problems facing designers working on Systems-on-a-Chip (SoCs) targeting energy-efficient design, and how Synopsys’ PrimeShield design robustness solution can help optimize designs for lower power while achieving aggressive time-to-market goals. This last part will delve into how the PrimeShield design robustness solution can help SoC designers optimize thei... » read more

Long-Haul Trucking With Fewer Drivers
By Ann Mutschler - 13 Sep, 2021 - Comments: 1

The trucking industry is betting heavily on increasing levels of autonomy and electrification to reduce the cost of moving goods and to overcome persistent problems. The economics of autonomous driving are compelling, not least of which is an almost perpetual shortage of qualified drivers. But there also are a number of technical hurdles to making this work. On top of the challenges facing t... » read more

SLM Is Changing The Complete Device Lifecycle Process
By Ramsay Allen - 13 Sep, 2021 - Comments: 0

Amit Sanghani, Vice President of Engineering, HW-Analytics and Test Group at Synopsys, discusses how Silicon Lifecycle Management (SLM) is changing the way we look at the complete device lifecycle process and how it can enable heightened levels of visibility in device performance, reliability and security. Learn how SLM is well placed to address the challenges that occur at every stage of cut... » read more

Wrestling With Analog At 3nm
By Brian Bailey - 09 Sep, 2021 - Comments: 0

Analog engineers are facing big challenges at 3nm, forcing them to come up with creative solutions to a widening set of issues at each new process node. Still, these problems must be addressed, because no digital chip will work without at least some analog circuitry. As fabrication technologies shrink, digital logic improves in some combination of power, performance, and area. The process te... » read more

Integrated Ethernet PCS And PHY IP For 400G/800G Hyperscale Data Centers
By Priyank Shukla - 09 Sep, 2021 - Comments: 0

Ethernet has become the primary network protocol of choice for the required server-to-server communication in hyperscale data centers, as it allows hyperscalers to disaggregate network switches and install their software operating systems independently. Ethernet enables cost-effective, dense, open switches and networking technologies which reduce cost/power per bit with transistor scaling. Ethe... » read more

Will Monolithic 3D DRAM Happen?
By Bryon Moyer - 09 Sep, 2021 - Comments: 1

As DRAM scaling slows, the industry will need to look for other ways to keep pushing for more and cheaper bits of memory. The most common way of escaping the limits of planar scaling is to add the third dimension to the architecture. There are two ways to accomplish that. One is in a package, which is already happening. The second is to sale the die into the Z axis, which which has been a to... » read more

Blog Review: Sept. 8
By Jesse Allen - 08 Sep, 2021 - Comments: 0

Synopsys' Scott Durrant considers the IP used in HPC SoCs and the efforts to simultaneously minimize data movement and maximize the speed at which data is transferred from one location to another, whether that data transfer is across long distances or from one chip to another within a server. Cadence's Paul McLellan looks into a new version of the Rowhammer DRAM vulnerability that can allow ... » read more

GPIOs: Critical IP For Functional Safety Applications
By Synopsys - 08 Sep, 2021 - Comments: 0

The prevalence and complexity of electronics and software (EE systems) in automotive applications are increasing with every new generation of car. The critical functions within the system on a chip (SoC) involve hardware and software that perform automotive-related signal communication at high data rates to and from the components off-chip. Every SoC includes general purpose IOs (GPIOs) on its ... » read more

New Memories Add New Faults
By Bryon Moyer - 07 Sep, 2021 - Comments: 1

New non-volatile memories (NVM) bring new opportunities for changing how we use memory in systems-on-chip (SoCs), but they also add new challenges for making sure they will work as expected. These new memory types – primarily MRAM and ReRAM – rely on unique physical phenomena for storing data. That means that new test sequences and fault models may be needed before they can be released t... » read more

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