tag: Applied Materials

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Apr, 2019 - Comments: 0

Public policy The rise of the digital economy is creating millions of new jobs, but it’s difficult to fill these positions. So, the Consumer Technology Association (CTA), a U.S.-based trade group, is encouraging hi-tech companies to offer more apprenticeships. This is especially true for software engineering, networking, data analytics, cybersecurity and artificial intelligence. The Semic... » read more

Single Vs. Multi-Patterning EUV
By Mark LaPedus - 25 Mar, 2019 - Comments: 5

Extreme ultraviolet (EUV) lithography finally is moving into production, but foundry customers now must decide whether to implement their designs using EUV-based single patterning at 7nm, or whether to wait and instead deploy EUV multiple patterning at 5nm. Each patterning scheme has unique challenges, making that decision more difficult than it might appear. Targeted for 7nm, single pattern... » read more

Selective Removal For Stronger Fins
By Matt Cogorno - 21 Mar, 2019 - Comments: 0

By Matt Cogorno and Toshihiko Miyashita Remember when we could charge our mobile phones on a Sunday and not even think about it again until the next weekend? There was a time when battery life wasn’t even in the top ten concerns when purchasing a mobile phone. Today however, smartphones are constantly being used for computing, gaming, video streaming and other power-hungry applications, so... » read more

EUV Mask Readiness Challenges
By Mark LaPedus - 21 Mar, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and photomask technologies with Emily Gallagher, principal member of the technical staff at Imec; Harry Levinson, principal at HJL Lithography; Chris Spence, vice president of advanced technology development at ASML; Banqiu Wu, senior director of process development at Applied Materials; and Aki Fujimura, chief ... » read more

Generation 10+ Fabs Enable Bigger, Brighter, Better TV Displays
By Applied Materials - 21 Mar, 2019 - Comments: 0

Consumers are moving to larger and larger televisions, attracted by the chance to have a more immersive experience and the ability to see what is on the screen from farther away. TV sizes continue to grow by 1 to 1.5 inches per year, and sales of TVs with 65” or larger screens—so-called Gen10+ flat panel displays (FPDs)—are growing exponentially (figure 1). Figure 1. Television shi... » read more

E-Beam Review And CD Measurement Revolutionizes Display Yield Management
By Applied Materials - 20 Mar, 2019 - Comments: 0

Fundamental changes are occurring in the display industry, driven by demands for higher-resolution screens and other capabilities for both mobile and TV applications. To meet these demands, the display technology roadmap in this article calls for innovations in materials, processes and device technology. Critical requirements include smaller design rules and the adoption of a range of materi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Mar, 2019 - Comments: 0

Chipmakers and OEMs Cypress Semiconductor has received regulatory antitrust approval for the closing of its previously-announced joint venture with SK Hynix. The new joint venture, SkyHigh Memory, will provide single-level cell (SLC) NAND memory solutions. Cree has announced the execution of a definitive agreement to sell its Lighting Products business unit (Cree Lighting), which includes t... » read more

Blog Review: Mar. 13
By Jesse Allen - 13 Mar, 2019 - Comments: 0

Mentor's Tom Fitzpatrick questions whether deep learning approaches can really help improve coverage in modern, complex designs. Cadence's Paul McLellan listens in at MWC as Huawei chairman Guo Ping defends the company's security practices and shows where its heading in 5G. Synopsys' Eric Huang checks out the newly announced USB4 specification, changes to previous USB names, and a few things ... » read more

Finding Defects In Chips With Machine Learning
By Mark LaPedus - 12 Mar, 2019 - Comments: 7

Chipmakers are using more and different traditional tool types than ever to find killer defects in advanced chips, but they are also turning to complementary solutions like advanced forms of machine learning to help solve the problem. A subset of artificial intelligence (AI), machine learning has been used in computing and other fields for decades. In fact, early forms of machine learning ha... » read more

Blog Review: Mar. 6
By Jesse Allen - 06 Mar, 2019 - Comments: 0

Synopsys' Snigdha Dua traces the evolution of memory from SDRAM to DDR5 and the techniques that provide each generation's speed increase. Cadence's Paul McLellan digs into the challenges of 112Gbps SerDes, including what makes PAM4 signaling different from NRZ and what goes into equalization and modeling. Mentor's Rich Edelman provides a quick tutorial on how to set up a custom UVM report... » read more

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