Reduce Augmented Reality Device Time-to-Market by Bringing Manufacturing Impact to Optical Simulation

By Synopsys - 24 Oct, 2024 - Comments: 0

Disruptive AR systems will push the limits of optics: limits in design, limits in manufacturing, and limits in overall system integration. The trend of optical components being integrated into more complex miniaturized systems is impacting optical software. Optical design software has been around for decades to design, simulate, and analyze any optical component from lenses and mirrors to light... » read more

Broad Impact From Accelerating Tech Cycles

By Ed Sperling - 21 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of leading edge technologies such as generative AI in data centers, AR/VR, and security architectures for connected devices, with Michael Kurniawan, business strategy manager at Accenture; Kaushal Vora, senior director and head of business acceleration and ecosystem at Renesas Electronics; Paul Karazuba, vice preside... » read more

Will 2024 Be The Year Of Layered Realities?

By Frank Schirrmeister - 25 Jan, 2024 - Comments: 0

January is always the month of predictions. Our team has already contributed to Semiconductor Engineering's 2023 Look Back and 2024 Outlook. My personal tradition has become to combine the outlook with a look back at what industry experts thought of a decade ago. While this involved a trip to my garage to pick up the respective January IEEE Spectrum issue a decade ago, the new reality is that a... » read more

Industry 4.0 Paradigms For Chip Workforce Development And Domestic Production: Using Automation And AR/VR

By Technical Paper Link - 07 Aug, 2023 - Comments: 0

A technical paper titled “From Talent Shortage to Workforce Excellence in the CHIPS Act Era: Harnessing Industry 4.0 Paradigms for a Sustainable Future in Domestic Chip Production” was published by researchers at University of Florida Gainesville, ZEISS Microscopy, and US Partnership for Assured Electronics (USPAE). Abstract: "The CHIPS Act is driving the U.S. towards a self-sustainable f... » read more

Red MicroLEDs Three Orders of Magnitude Smaller in Surface Area

By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A technical paper titled "N-polar InGaN/GaN nanowires: overcoming the efficiency cliff of red-emitting micro-LEDs" was published by researchers at University of Michigan. The researchers created "red-microLEDs that are nearly three orders of magnitude smaller in surface area than previously reported devices while exhibiting external quantum efficiency of ~1.2%," according to the University o... » read more

Chip Challenges In The Metaverse

By Marie C. Baca and Ed Sperling - 24 Oct, 2022 - Comments: 0

The metaverse is pushing the limits of chip design, despite uncertainty about how much raw horsepower these devices ultimately will require to deliver an immersive blend of augmented, virtual, and mixed reality. The big challenge in developing these systems is the ability to process mixed data types in real time while the data moves uninterrupted at lightning speed. That requires the integra... » read more

Design And Security Challenges for VR

By John Koon - 10 Aug, 2022 - Comments: 0

Virtual reality is no longer just for gamers, and as this technology is deployed in everything from health care to industrial training, the requirements for processing more data faster over a high-speed connection are growing. Designing these devices continues to be a study in contradictions. They must be extremely low power, with a small enough batteries to make them comfortable to wear. Bu... » read more

Three Technologies Enabling The Next Decade Of Hyperconnectivity

By Frank Schirrmeister - 27 Jan, 2022 - Comments: 0

As it has become a tradition in my 15 years of blogging, January is a month of both reflection and outlook. At the beginning of 2022, I am excited that key themes from 5 and 10 years ago—3D integration, artificial intelligence and machine learning (AI/ML), and ubiquitous needs for more connectivity driving 4G and 5G networks—clearly have exceeded expectations and forecasts from that time. L... » read more

Smart Glasses, Augmented Reality, And Time-of-Flight Imaging

By Edmund Neo - 20 Dec, 2021 - Comments: 0

By Edmund Neo and Rolf Weber Augmented reality (AR) is frequently discussed for providing new, exciting, vision-related products for consumer and industrial applications. One popular AR implementation uses AR glasses. While the global market for smart augmented reality glasses was only 255,600 units in 2020, market researchers predict robust growth and a volume of 8.8 million units by 2026 [... » read more

Get Ready For The Next Generation Of Wearable Tech

By Brian Bailey - 18 Oct, 2021 - Comments: 0

Wearables have attracted a lot of attention recently, due to both their successes as well as failures. They bring together requirements for packaging, new substrates, power scavenging, low-power, novel connectivity, flexibility, durability, as well as fashion. While some of the challenges remain formidable, the long-term potential is driving the industry to look at what is possible. They are... » read more

← Older posts

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.