5 Major Shifts In Automotive


Much of the automotive industry has begun repositioning and retrenching over the past few months, pushing back the projected rollout for fully autonomous vehicles and changing direction on power sources and technology used in the next-generation of electric vehicles. Taken together, these shifts mark a significant departure for traditional automakers, which find themselves playing catch-up t... » read more

Week In Review: Manufacturing, Test


Chipmakers United Microelectronics Corp. (UMC) has announced the readiness of its new 22nm process. The process enables new 22nm designs or allows customers to migrate from 28nm to 22nm. UMC’s 22nm maintains its existing 28nm design architectures. UMC's 22nm process features a 10% area reduction, better power-to-performance ratio and enhanced RF capabilities, compared to the company’s 2... » read more

Week In Review: Design, Low Power


Cadence signed a deal to buy National Instruments’ AWR business unit for about $160 million in cash, a move that Cadence describes as a way to broaden its market into intelligent system design. AWR’s strength is high-frequency RF design automation tools, particularly in the millimeter wave and microwave spectrums, which are critical for radar and 5G. It also has technology for III-V materia... » read more

Week In Review: IoT, Security, Auto


Internet of Things SiFive is bringing RISC-V to IoT makers and university developers through the RISC-V-based SiFive Learn Initiative, an open-source learning package that can be used to create a low-cost RISC-V hardware compatible with AWS IoT Core. The development platform SiFive Learn Inventor has a software package and education enablement course. It includes: The programmable SiFive Lear... » read more

Betting On Hydrogen-Powered Cars


The automotive industry is taking another look at hydrogen fuel cells, but how they ultimately fare depends on a combination of consumer demand, automaker investment and infrastructure build-out. Hydrogen fuel cell technology has been steadily advancing over the past six decades since the first practical fuel cell system was demonstrated by Cambridge engineering professor Francis Bacon. The ... » read more

Getting To Orbit And The Rocket Equation


The Apollo 12 mission recently celebrated its 50th anniversary. Launching on November 14, 1969 and returning on November 24, it put humans on the Moon for the second time. I wrote about Apollo 11 (mostly about its guidance computer) earlier in the year in my post The First Computer on the Moon. Today's post is about the rocket equation, and how challenging it is to get into orbit around th... » read more

Fixed and Floating FMCW Radar Signal Processing with Tensilica DSPs


Automotive advanced driver assistance system (ADAS) applications increasingly demand radar modules with better capability and performance. These applications require sophisticated radar processing algorithms and powerful digital signal processors (DSPs) to run them. Because these embedded systems have limited power and cost budgets, the DSP’s instruction set architecture (ISA) needs to be eff... » read more

Blog Review: Dec. 4


Arm's Rupal Gandhi digs into the Cell-Aware Test methodology to deterministically target the growing number of defects that occur within the cells, the process of CAT library generation, and compares the static and transition patterns generated. Cadence's Paul McLellan shares highlights from the recent WOSET event with a look at the big drivers for the current interest in open-source EDA too... » read more

Cadence To Buy NI’s AWR Unit For $160M


Cadence signed a deal to buy National Instruments' AWR business unit for about $160 million in cash, a move that Cadence describes as a way to broaden its market into intelligent system design. AWR's strength is high-frequency RF design automation tools, particularly in the millimeter wave and microwave spectrums, which are critical for radar and 5G. Both of those technologies are expected t... » read more

Thermal Challenges In Advanced Packaging


CT Kao, product management director at Cadence, talks with Semiconductor Engineering about why packaging is so complicated, why power and heat vary with different use cases and over time, and why a realistic power map is essential particularly for AI chips, where some circuits are always on.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTube channel here » read more

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