tag: hot carrier injection

Improving Reliability For GaN And SiC
By Mark LaPedus - 18 Jun, 2020 - Comments: 2

Suppliers of gallium nitride (GaN) and silicon carbide (SiC) power devices are rolling out the next wave of products with some new and impressive specs. But before these devices are incorporated in systems, they must prove to be reliable. As with previous products, suppliers are quick to point out that the new devices are reliable, although there are some issues that can occasionally surface... » read more

What’s Holding Back Aging Simulation?
By Andre Lange - 09 Apr, 2020 - Comments: 0

Aging simulation supplies information about the long-term behavior before an IC enters into production, providing an important early evaluation of the reliability required by the application and specification. Re-designs due to reliability issues, and over-design with excessive safety margins, are avoided in this way. In addition, the long-term stability can be demonstrated to the customer. ... » read more

Toward Consistent Circuit-Level Aging Simulations In Different EDA Environments
By Fraunhofer IIS/EAS - 10 Apr, 2019 - Comments: 0

Aging simulations on circuit level allow integrated circuit (IC) designers to verify their circuits with respect to lifetime reliability requirements by considering the degradation of field effect transistors (FETs). To obtain significant analysis results with a reasonable effort, two prerequisites have to be fulfilled. First, reasonable models for FET degradation effects have to be set up. Sec... » read more

The Time Is Now For A Common Model Interface
By Ahmed Ramadan - 28 Feb, 2019 - Comments: 0

By Ahmed Ramadan and Greg Curtis Driven by consumer demand for “cheaper, faster, and better,” the semiconductor industry is continually pushing the migration to smaller process geometries. This continued scaling of complex designs into advanced process nodes is critical for applications ranging from high-performance computing to low-power mobile devices. In the past, products like sma... » read more

Chip Aging Becomes Design Problem
By Brian Bailey - 09 Aug, 2018 - Comments: 9

Chip aging is a growing problem at advanced nodes, but so far most design teams have not had to deal with it. That will change significantly as new reliability requirements roll out across markets such as automotive, which require a complete analysis of factors that affect aging. Understanding the underlying physics is critical, because it can lead to unexpected results and vulnerabilities. ... » read more

Aging Effects
By Ed Sperling - 17 Jul, 2018 - Comments: 0

Tech Talk: Fraunhofer EAS' group manager for quality and reliability, Andre Lange, talks about how to model aging effects and why the problems are becoming more difficult at advanced nodes. https://youtu.be/XHWww2PE7aY » read more

System-Level Power Modeling Takes Root
By Ann Mutschler - 10 May, 2018 - Comments: 0

Power, heat, and their combined effects on aging and reliability, are becoming increasingly critical variables in the design of chips that will be used across a variety of new and existing markets. As more processing moves to edge, where sensors are generating a tsunami of data, there are a number of factors that need to be considered in designs. On one side, power budgets need to reflect th... » read more

Aging Models: The Basis For Predicting Circuit Reliability
By Andre Lange - 12 Apr, 2018 - Comments: 0

Today, many products are based on high-performance electronic systems and integrated circuits (ICs), and the importance of these elements is ever-increasing. A certain tension arises here as these applications often call for a large amount of processing power and reliability. The processing power can best be supplied with highly scaled semiconductor technologies. However, these manufacturing te... » read more

Transistor Aging Intensifies At 10/7nm And Below
By Ann Mutschler - 13 Jul, 2017 - Comments: 0

Transistor aging and reliability are becoming much more troublesome for design teams at 10nm and below. Concepts like ‘infant mortality’ and 'bathtub curves' are not new to semiconductor design, but they largely dropped out of sight as methodologies and EDA tools improved. To get past infant mortality, a burn-in process would be done, particularly for memories. And for reliability, which... » read more

Will Self-Heating Stop FinFETs
By Katherine Derbyshire - 20 Apr, 2017 - Comments: 0

New transistor designs and new materials don’t appear out of thin air. Their adoption always is driven by the limitations of the incumbent technology. Silicon germanium and other compound semiconductors are interesting because they promise superior carrier mobility relative to silicon. [getkc id="185" kc_name="FinFET"] transistor designs help minimize short channel effects, a critical limi... » read more

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