tag: hybrid bonding

Interconnect Innovations In High Bandwidth Memory: Part 2
By Damon Tsai - 14 Oct, 2025 - Comments: 0

By Damon Tsai, Woo Young Han, and Tim Kryman Interconnect technology in high bandwidth memory (HBM) is at a fork in the road. One direction leads to tried-and-true microbump technology, and the other leads to a compelling alternative, hybrid bonding. Both technologies are evolving to address the stringent requirements of next generation HBM in pursuit of increased I/O density supporting high... » read more

Enabling In-Line Process Control for Hybrid Bonding Applications
By Onto Innovation - 14 Oct, 2025 - Comments: 0

As demand grows for high-performance computing (HPC) and AI-driven applications, manufacturers are turning to hybrid bonding to enable the ultra-dense 3D integration required for next-generation chip architectures. This advanced packaging technology presents significant process challenges. Surface preparation must be precisely controlled to eliminate particles, excess recess, and copper pad ... » read more

CDI For The Metrology Of Copper Pads Used In Hybrid Bonding (Paul Scherrer Institute, Samsung)
By Technical Paper Link - 03 Oct, 2025 - Comments: 0

A new technical paper titled "Coherent diffractive imaging simulations for wafer inspection of periodic structures" was published by researchers at the Paul Scherrer Institute and Samsung. Excerpt "We present a study of phase retrieval algorithms applied to the metrology of copper pad topography for hybrid bonding. We demonstrate that by including a priori information in the update functi... » read more

Interconnect Innovations In High Bandwidth Memory: Part 1
By Damon Tsai - 09 Sep, 2025 - Comments: 0

By Damon Tsai, Woo Young Han, and Tim Kryman The demand for high bandwidth memory (HBM) is accelerating across the semiconductor industry, driven by boundary-pushing artificial intelligence, high-performance computing, and advanced graphics. These technologies require access to vast datasets, which in turn increases the need for memory solutions that combine speed, density, and power efficie... » read more

Challenges In Stacking HBM
By Ed Sperling - 03 Sep, 2025 - Comments: 1

AI data centers are pushing for higher density in high-bandwidth memory. Today, the maximum number of layers that can be stacked is 8, but that increases to as many as 24 layers by 2030. The big challenge will be in the interconnects, and making sure the microbumps align. At 16 layers, the bump pitch will be less than 10 microns, and the dies will be thinner. Damon Tsai, head of product marketi... » read more

Manufacturing At The Limits
By Gregory Haley - 21 Aug, 2025 - Comments: 2

Hybrid bonding has been in production for several years, with mature flows capable of delivering robust yields using 10µm interconnects. At that scale, processes can tolerate hundreds of nanometers of overlay variation, modest differences in wafer bow, and particle sizes rivaling the interconnect height without catastrophic impact. Hybrid bonding is compatible with optical metrology, existing ... » read more

Transferable Hybrid Bonding Technique That Allows For High Integration Density In Advanced Packaging
By Brewer Science - 21 Aug, 2025 - Comments: 0

A technical paper titled "Hierarchical Multi-Layer and Stacking Vias with Novel Structure by Transferrable Cu/Polymer Hybrid Bonding for High Speed Digital Applications" was published by researchers at Industrial Technology Research Institute (ITRI) and Brewer Science. The paper demonstrates a "novel structure with hierarchical multi-layer stacking vias as well as transferred hybrid bonding,... » read more

Metrology Under Pressure: Detecting Defects in Fine-Pitch Hybrid Bonding
By Gregory Haley - 12 Aug, 2025 - Comments: 1

As advanced packaging pushes deeper into the sub-10µm realm, traditional inspection and metrology systems are being forced to evolve with it. Hybrid bonding, a critical enabler of vertical integration and 3D system performance, relies on exceptionally tight alignment and defect-free bonding surfaces. But as interconnect pitch shrinks, even nanometer-scale variations in height, tilt, or cont... » read more

3DICs: Atomic-Scale Behavior of Electromigration in Cu−Cu Joints (NYCU, ITRI)
By Technical Paper Link - 05 Aug, 2025 - Comments: 0

A new technical paper titled "In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density" was published by researchers at National Yang Ming Chiao Tung University (NYCU) and the Industrial Technology Research Institute (ITRI). Excerpt "Electromigration (EM) poses significant challenges to the reliability of miniaturized devices, particularly th... » read more

Nanoimprint-Based Dielectric Patterning for Fine-Pitch Hybrid Bonding (Seoul National Univ. of Science and Technology)
By Technical Paper Link - 30 Jul, 2025 - Comments: 0

A new technical paper titled "Hybrid Bonding with Polymeric Interlayer Dielectric Layers Patterned by Nanoimprint Lithography" was published by researchers at Seoul National University of Science and Technology. Abstract "Recent advancements in semiconductor technology have shifted the focus of innovation toward advanced packaging technologies featuring heterogeneous integration. Among thes... » read more

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