tag: imec

Transistor Options Beyond 3nm
By Mark LaPedus - 15 Feb, 2018 - Comments: 18

Despite a slowdown in chip scaling amid soaring costs, the industry continues to search for a new transistor type 5 to 10 years out—particularly for the 2nm and 1nm nodes. Specifically, the industry is pinpointing and narrowing down the transistor options for the next major nodes after 3nm. Those two nodes, called 2.5nm and 1.5nm, are slated to appear in 2027 and 2030, respectively, accord... » read more

EUV Reticle Print Verification With Advanced Broadband Optical Wafer Inspection And e-Beam Review Systems
By KLA - 14 Feb, 2018 - Comments: 0

As the Extreme Ultraviolet (EUV) lithography ecosystem is being actively mapped out to enable sub-7nm design rule devices, there is an immediate and imperative need to identify the EUV reticle (mask) inspection methodologies. The introduction of additional particle sources due to the vacuum system and potential growth of haze defects or other film or particle depositions on the reticle, in comb... » read more

Nodes Vs. Nodelets
By Mark LaPedus - 22 Jan, 2018 - Comments: 0

Foundries are flooding the market with new nodes and different process options at existing nodes, spreading confusion and creating a variety of challenges for chipmakers. There are full-node processes, such as 10nm and 7nm, with 5nm and 3nm in R&D. But there also is an increasing number of half-nodes or "node-lets" being introduced, including 12nm, 11nm, 8nm, 6nm and 4nm. Node-lets ar... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Jan, 2018 - Comments: 0

Chipmakers Intel and Micron have ended their long-running NAND joint development partnership. The companies will continue to develop NAND, but they will work independently on future generations of 3D NAND. The companies have agreed to complete the development of their third-generation of 3D NAND technology, which will be delivered towards the end of 2018. That is expected to be a 96-layer ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 Jan, 2018 - Comments: 0

Chipmakers Semiconductor IP startup eVaderis has demonstrated a design platform through an ultra-low-power microcontroller (MCU) in Beyond Semiconductor’s BA2X product line. The software, system and memory IP developed by eVaderis make Beyond Semiconductor’s new MCU ideally suited for battery-powered applications in IoT and wearable electronics. By incorporating the latest STT-MRAM tec... » read more

A New Memory Contender?
By Mark LaPedus - 02 Jan, 2018 - Comments: 1

Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more

Custom Vs. Non-Custom Design
By Ed Sperling - 21 Dec, 2017 - Comments: 1

Semiconductor Engineering sat down to discuss custom designs with Yong Pang, head of North American operations for [getentity id="22217" e_name="Imec"]; Phil Burr, director of portfolio product management for [getentity id="22186" e_name="Arm's"] embedded and automotive groups; Ambar Sarkar, chief technologist at eInfochips; and John Tinson, vice president of sales at Sondrel. What follows are ... » read more

3D Neuromorphic Architectures
By Katherine Derbyshire - 11 Dec, 2017 - Comments: 1

Matrix multiplication is a critical operation in conventional neural networks. Each node of the network receives an input signal, multiplies it by some predetermined weight, and passes the result to the next layer of nodes. While the nature of the signal, the method used to determine the weights, and the desired result will all depend on the specific application, the computational task is simpl... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Dec, 2017 - Comments: 0

Fab tools and test Four former employees at Applied Materials were charged by the U.S. for allegedly trying to steal the company’s own fab tool technology designs, according to a report from Bloomberg and others. The former employees were allegedly trying to sell the technology to a Chinese startup that would compete against Applied, according to the report. The former employees--Liang C... » read more

Here Comes High-Res Car Radar
By Mark LaPedus - 20 Nov, 2017 - Comments: 1

A dozen or so startups are developing high-resolution radar chips that use various modulation schemes and processes, such as CMOS, FD-SOI and even metamaterials. In theory, high-resolution radar could boost the capabilities of today’s radar for cars, as well as eliminate the need for a separate LiDAR system. But the technology is still in the research stage and has yet to be proven commerc... » read more

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