Research Bits: May 10


Growing 2D TMDs on chips Researchers from Massachusetts Institute of Technology (MIT), Oak Ridge National Laboratory, and Ericsson Research found a way to “grow” layers of 2D transition metal dichalcogenide (TMD) materials directly on top of a fully fabricated silicon chip, a technique they say could enable denser integrations. The researchers focused on molybdenum disulfide, which is f... » read more

Week In Review: Design, Low Power


The National Institute of Standards and Technology (NIST) outlined its plan for a National Semiconductor Technology Center (NSTC) to be created using a share of the $11 billion in funds from the CHIPS Act marked for research and development. While a large portion of the CHIPS Act investment is set to boost U.S. fabs and manufacturing capabilities, the NSTC aims to also support the design side, ... » read more

Research Bits: April 18


Simplified microwave photonic filter for 6G Researchers from Peking University developed a new chip-sized microwave photonic filter to separate communication signals from noise and suppress unwanted interference across the full radio frequency spectrum. “This new microwave filter chip has the potential to improve wireless communication, such as 6G, leading to faster internet connections, ... » read more

Week In Review: Design, Low Power


Arm and Intel Foundry Services inked a multi-generation agreement to enable chip designers to build Arm-based SoCs on the Intel 18A process. The initial focus is mobile SoC designs, but the deal allows for potential expansion into automotive, IoT, data center, aerospace, and government applications. IFS and Arm will undertake design technology co-optimization (DTCO) to optimize chip design and ... » read more

Research Bits: March 21


Micropatterning with sugar A scientist at the National Institute of Standards and Technology (NIST) discovered a transfer printing process that can deposit microcircuit patterns on curved and textured surfaces using sugar candy. Transfer printing methods, such as flexible tapes, are often used for surfaces that are difficult to directly print on. But they have difficulty with conforming to ... » read more

Lightweight Cryptography: An Introduction


The National Institute of Standards and Technology (NIST) announced on February 7, 2023, that it had selected the ASCON algorithm to become the standard for Lightweight Cryptography. In this whitepaper, we will explore what lightweight cryptography is and why it is worth considering for specific Internet of Things (IoT) use cases. Download this white paper to learn: What lightweight cry... » read more

Research Bits: Jan. 24


Transistor-free compute-in-memory Researchers from the University of Pennsylvania, Sandia National Laboratories, and Brookhaven National Laboratory propose a transistor-free compute-in-memory (CIM) architecture to overcome memory bottlenecks and reduce power consumption in AI workloads. "Even when used in a compute-in-memory architecture, transistors compromise the access time of data," sai... » read more

Research Bits: Dec. 13


Electronic-photonic interface for data centers Engineers at Caltech and the University of Southampton integrated an electronic and photonic chip for high-speed communication in data centers. "There are more than 2,700 data centers in the U.S. and more than 8,000 worldwide, with towers of servers stacked on top of each other to manage the load of thousands of terabytes of data going in and o... » read more

Week In Review: Design, Low Power


Cadence unveiled a big data analytics infrastructure to unify massive data sets across all Cadence computational software. The Joint Enterprise Data and AI (JedAI) Platform aims to optimize multiple runs of multiple engines across an entire SoC design and verification flow. It combines data from its AI-driven Cerebrus implementation and Optimality system optimization solutions, along with the n... » read more

Week In Review: Design, Low Power


Tools, IP, design Infineon Technologies acquired NoBug, a provider of design verification services. The acquisition will help Infineon expand its IoT R&D business in eastern Europe. “This considerable increase in superior verification know-how lets Infineon offer its customers more of its leading products at a reduced time-to-market,” said Guenter Krasser, Vice President and Managing D... » read more

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