tag: On Semiconductor

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Aug, 2019 - Comments: 0

Fab tools Lam Research has rolled out two new tools for use in the production of 3D NAND. The first tool, called the VECTOR DT, is geared for backside deposition. The second system, the EOS GS, is a wet etch tool for film removal on backside and bevel. Designed to control the wafer bow in 3D NAND manufacturing, the VECTOR DT system is the latest addition to Lam’s plasma-enhanced chemical ... » read more

Blog Review: Aug. 7
By Jesse Allen - 07 Aug, 2019 - Comments: 0

Synopsys' Taylor Armerding considers whether ransomware attacks on cities aren't only about money but if there are political motivations for intentionally sowing chaos and dysfunction. Cadence's Paul McLellan takes a look at the different way radio spectrum for 5G is being allocated in the U.S., which recently auctioned 24GHz bands for mmWave, and the rest of the world, which has focused on ... » read more

Hierarchical DFT On A Flat Layout Design
By Vidya Neerkundar - 06 Aug, 2019 - Comments: 0

The use of hierarchical DFT methods is growing as design size and complexity stresses memory requirements and design schedules.  Hierarchical DFT divides the design into smaller pieces, creates test structures and patterns at the core level, then retargets the core patterns to the chip level. But, if you need to perform the physical place and route on the full flat design, can you still take a... » read more

ON Semiconductor Reduces Memory BiST Insertion Time By 6X With Tessent Hierarchical Flow
By Mentor, a Siemens Business - 05 Aug, 2019 - Comments: 0

This paper describes a case study on the insertion of memory BiST for an ON Semiconductor multi-million gate-level netlist with 300 memory instances. The physical implementation will be done using a flat layout. Two different methodologies can be applied when it comes to physical implementation; hierarchical or fullflat. When performing physical implementation as full-flat flow, typically the D... » read more

Week in Review – IoT, Security, Auto
By Jeff Dorsch - 21 Jun, 2019 - Comments: 0

Products/Services Arteris IP reports Achronix Semiconductor licensed the Arteris FlexNoC interconnect IP for its new Speedster7t line of FPGAs. Speedster7t features ASIC-like performance, FPGA adaptability, and enhanced functionality to streamline design. "Our new Speedster7t FPGA family requires extremely high on-chip bandwidth and advanced dataflow arbitration to make possible ASIC-class mac... » read more

Week In Review: Design, Low Power
By Jesse Allen - 21 Jun, 2019 - Comments: 0

ON Semiconductor completed its $946 million acquisition of Quantenna Communications, a San Jose-based company that specializes in Wi-Fi chips and software. Aldec introduced automatic UVM register generation to its Riviera-PRO verification platform. Riviera-PRO can now accept a CSV file or IP-XACT register description as an input and, working at the Register Abstraction Layer (RAL) of UVM, ou... » read more

Falling Chip Forecasts
By Mark LaPedus - 20 Jun, 2019 - Comments: 1

It’s time to take a pulse of the semiconductor market amid the memory downturn and trade frictions with China. For some time, the DRAM and NAND markets have been hit hard with falling prices and oversupply. Then, the Trump administration last year slapped tariffs on Chinese goods. China retaliated. And the trade war rages on between the U.S. and China. More recently, the U.S. Department... » read more

Automotive Semiconductors Boost MCU, Analog Markets
By Jim Feldhan - 20 Jun, 2019 - Comments: 0

Auto sales are expected to experience a slowdown in 2019, and even with the continued increase in electronics per vehicle, automotive semiconductor sales are also expected to experience a slowdown. Similar to prior years, 2019/2020 car models will include more automotive semiconductor devices to provide higher degrees of safety, comfort and convenience, driver assist capabilities, in-cabin ente... » read more

Wrestling With High-Speed SerDes
By Ann Mutschler - 19 Jun, 2019 - Comments: 2

SerDes has emerged as the primary solution in chips where there is a need for fast data movement and limited I/O, but this technology is becoming significantly more challenging to work with as speeds continue to rise to offset the massive increase in data. A Serializer/Deserializer is used to convert parallel data into serial data, allowing designers to speed up data communication without h... » read more

Inspection, Metrology Challenges Grow For SiC
By Mark LaPedus - 11 Jun, 2019 - Comments: 2

Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it’s becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of a... » read more

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