tag: Siemens EDA

The Easy Stuff Is Over
By Ed Sperling - 09 Aug, 2012 - Comments: 0

By Ed Sperling Doomsayers have been predicting the end of Moore’s Law for the better part of a decade. While it appears that it will still remain viable for some companies—Intel and IBM already are looking into single digits of nanometers and researchers speculating about picometer designs—for most companies the race is over. Progress will still be made in moving SoCs from one node to... » read more

AMD’s Bobcat Processor
By Barry Pangrle - 09 Aug, 2012 - Comments: 0

Barry Pangrle The International Symposium on Low Power Electronics and Design (ISLPED) was held last week in Redondo Beach, California. There were many good presentations and keynote addresses and a topic that’s near to my heart, near-threshold voltage computing, was often discussed along with how best to (or not) handle variability. One paper out of many that caught my attention was The ... » read more

Experts At The Table: Challenges At 20nm
By Ed Sperling - 09 Aug, 2012 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss the challenges at 20nm and beyond with Jean-Pierre Geronimi, special projects director at STMicroelectronics; Pete McCrorie, director of product marketing for silicon realization at Cadence; Carey Robertson, director of product marketing at Mentor Graphics; and Isadore Katz, president and CEO of CLK Design Automation. Wh... » read more

Getting In the Ballpark
By Ann Mutschler - 09 Aug, 2012 - Comments: 0

I admit it; I still have DAC on the brain. Even though attendance may not have been what the exhibitors would have liked to see, the conference is always a fantastic place to discuss ideas and pick up on trends. One topic I discussed with a number of folks are the challenges associated with design today, from the power-performance balance, 3D stacking to new process nodes and complexity, to nam... » read more

Experts At The Table: Multipatterning
By Ed Sperling - 31 Jul, 2012 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down with Michael White, physical verification product line manager at Mentor Graphics; Luigi Capodieci, R&D fellow at GlobalFoundries; Lars Liebmann, IBM distinguished engineer; Rob Aitken, ARM fellow; Jean-Pierre Geronimi, CAD director at STMicroelectronics; and Kuang-Kuo Lin, director of foundry design enablement at Samsung El... » read more

DSA Moves To R&D Pilot Lines
By Ed Sperling - 31 Jul, 2012 - Comments: 0

By Mark LaPedus Directed self-assembly (DSA), an alternative lithography technology that makes use of block copolymers, is still in the R&D stage for semiconductor production. But as the exotic patterning technology continues to make astounding progress, there are signs the IC industry is accelerating its efforts to bring DSA from the lab to the fab. In fact, DSA suddenly has become a ... » read more

Looking Into The Future
By Ed Sperling - 31 Jul, 2012 - Comments: 0

Semiconductor Manufacturing & Design sat down with Juan Rey, senior director of engineering for Calibre at Mentor Graphics, about multipatterning, design rules and silicon photonics. [youtube vid=KoH5TwmFWDM] » read more

Experts At The Table: Stacking The Deck
By Ed Sperling - 26 Jul, 2012 - Comments: 0

By Ann Steffora Mutschler There is no doubt 3D stacking brings challenges not only from the design perspective, but also on the tool side. EDA vendors have been working for more than a few years to ready tools for stacked-die designs. How smooth the transition is, however, is a big question mark. Because the approach is new, not all the challenges are fully understood yet. And while most ED... » read more

Routing Congestion Returns
By Ed Sperling - 26 Jul, 2012 - Comments: 0

By Ed Sperling Routing congestion has returned with a vengeance to SoC design, fueled by the advent of more third-party IP, more memory, a variety of new features, as well as the inability to scale wires at the same rate as transistors. This is certainly not a foreign concept for IC design. The markets for place and route tools were driven largely by the need to automate this kind of operat... » read more

Smarter Co-design With Models
By Ed Sperling - 26 Jul, 2012 - Comments: 0

By Ann Steffora Mutschler IC, package and PCB co-design methodologies are starting to be adopted by semiconductor companies. However, the existing die abstract file used in these flows to exchange data between the IC designer and the downstream package design team may not contain enough detail to drive advanced planning and optimization with the package and PCB interfaces. Engineering teams... » read more

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