tag: SPIE

Manufacturing Bits: Feb. 24
By Mark LaPedus - 24 Feb, 2015 - Comments: 0

EUV progress report At the SPIE Advanced Lithography conference in San Jose, Calif., ASML Holding said that one customer, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), has exposed more than 1,000 wafers on an NXE:3300B EUV system in a single day. This is one step towards the insertion of EUV lithography in volume production. During a recent test run on the system, TSMC exposed 1,022 w... » read more

Executive Insight: Elmar Platzgummer
By Mark LaPedus - 13 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss photomask and lithography trends with Elmar Platzgummer, chief executive of IMS Nanofabrication, an Austrian-based supplier of multi-beam e-beam tools for mask writing applications. SE: IMS has shipped the world’s first multi-beam e-beam system. Initially targeted for photomask writing, the tools are currently being tested in the field. How lon... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Aug, 2014 - Comments: 0

Intel announced two new technologies for foundry customers. One technology, dubbed Embedded Multi-die Interconnect Bridge (EMIB), is available to 14nm foundry customers. Instead of an expensive silicon interposer with TSVs, a small silicon bridge chip is embedded in the package, enabling high density die-to-die connections only where needed. EMIB eliminates the need for TSVs and specialized int... » read more

Blog Review: March 26
By Ed Sperling - 26 Mar, 2014 - Comments: 0

Synopsys’ Eric Huang has discovered a video of Superman using a GoPro camera (scroll down to bottom of page). So this is what it’s like to stop bullets with your hand. Cadence’s Tom Hackett zeroes in on mobile interfaces in a video—SoC fabric, memory and chip-to-chip. Nice whiteboard drawing. Mentor’s Anil Khanna looks at a methodology for developing high-performance embedded so... » read more

Directed Self-Assembly Gains Momentum
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

At last year’s SPIE Advanced Lithography symposium, directed self-assembly (DSA) grabbed the spotlight as chipmakers provided the first glimpse of their initial work and results with the technology. The results were stunning, thereby propelling DSA from a curiosity item to a possible patterning solution for next-generation devices. Last year, in fact, GlobalFoundries, IBM, Intel and Sams... » read more

Under The Radar At SPIE
By Mark LaPedus - 20 Mar, 2014 - Comments: 2

At the SPIE Advanced Lithography symposium, the best and brightest minds in the lithography, metrology, resist and design-for-manufacturing (DFM) fields assemble for a week. The annual event is a good way to get a pulse on the current state of lithography. At this year’s SPIE, it was simple to get a reading. Extreme ultraviolet (EUV) lithography remains delayed. The other next-generation l... » read more

One-on-One: Naoya Hayashi
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the current and future challenges in the photomask industry with Naoya Hayashi, research fellow at Dai Nippon Printing (DNP). SE: What are the big challenges for the photomask industry today? Hayashi: There are several challenges. Most of the challenges involve mask complexity. It is also quite difficult to handle the mask data, because it is ... » read more

Advanced Lithography: Moore’s Law Moves On
By Marc David Levenson - 20 Mar, 2014 - Comments: 1

Every February, experts in nano patterning technologies converge in San Jose, Calif., to present their road maps, brainstorms and results at the SPIE Advanced Lithography Symposium. This year, there was more confusion than ever, partly the result of sessions in unlabeled (but beautiful) new ballrooms at the Convention Center, but mostly because of industry divergences. There is no longer a s... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Feb, 2014 - Comments: 0

SPIE Advanced Lithography is a patterning show. At the event, however, Applied Materials revealed more details regarding its selective materials removal opportunity, according to Weston Twigg, an analyst with Pacific Crest Securities, in a research note. Applied Materials presented a paper entitled, “Where Is Plasma Etching Going from Here?” “The presenter outlined concepts for thin layer... » read more

Lithography-Enabled Scaling Challenges
By Ehud Tzuri - 20 Feb, 2014 - Comments: 0

The semiconductor industry is being challenged as never before when it comes to lithography-enabled scaling. While development of new patterning techniques and resists as well as inspection and metrology capabilities have helped device scaling advance, major issues continue to challenge the future of Moore’s Law. There’s an industry shift from lithography-enabled 2D devices to materials-ena... » read more

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