category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Data Sharing And Digital Threads
By Michael Schuldenfrei - 07 May, 2019 - Comments: 0

Electronics and the components that power them are more complex and advanced than ever. With these products an integral part of our daily lives, their reliability has become nothing less than mission-critical. As the demand for components accelerates, it is important that quality is not compromised under the pressure to meet quantity requirements. Otherwise we’re going to be seeing a lot of r... » read more

Modernizing Test In Aerospace And Defense
By Luke Schreier - 07 May, 2019 - Comments: 0

These days, you can’t attend a conference or have a conversation with leaders of the aerospace and defense community without touching on the modernization of the sector. This includes the integration of new technologies and processes to address aging equipment and fleets. The scale of the challenges in this space is too large, the costs are too high, and the impact of failure is too great to ... » read more

Making AI More Dependable
By Ed Sperling - 07 May, 2019 - Comments: 0

Ira Leventhal, vice president of Advantest’s new concept product initiative, looks at why AI has taken so long to get going, what role it will play in improving the reliability of all chips, and how to use AI to improve the reliability of AI chips themselves. » read more

Preparing For War On The Edge
By Ed Sperling - 09 Apr, 2019 - Comments: 0

War clouds are gathering over the edge of the network. The rush by the reigning giants of data—IBM, Amazon, Facebook, Alibaba, Baidu, Microsoft and Apple—to control the cloud by building mammoth hyperscale data centers  is being met with uncertainty at the edge of the network. In fact, just the emergence of the edge could mean that all bets are off when it comes to data dominance. It... » read more

Racing To The Edge
By SE Staff - 09 Apr, 2019 - Comments: 0

The race is on to win a piece of the edge, despite the fact that there is no consistent definition of where the edge begins and ends or how the various pieces will be integrated or ultimately tested. The edge concept originated with the Internet of Things, where the initial idea was that tens of billions of dumb sensors would communicate through gateways to the cloud. That idea persisted unt... » read more

New Approaches To Security
By Ed Sperling - 09 Apr, 2019 - Comments: 0

Different approaches are emerging to identify suspicious behavior and shut down potential breaches before they have a chance to do serious damage. This is becoming particularly important in markets where safety is an issue, and in AI and edge devices where the rapid movement of data is essential. These methods are a significant departure from the traditional way of securing devices through l... » read more

X-Ray Reveals Wire Bonding And Field Failures
By DELTA, a part of FORCE Technology - 09 Apr, 2019 - Comments: 0

Wire bonding is widely used for first-level interconnection of semiconductor die to component leads or pads. It is vital that the interconnection corresponds to the product-specific bonding diagram and that the wire bonding is of an acceptable robustness and quality. X-ray technology is critical for ensuring both. To read more, click here. » read more

How To Manage DFT For AI Chips
By Rahul Singhal - 09 Apr, 2019 - Comments: 0

Semiconductor companies are racing to develop AI-specific chips to meet the rapidly growing compute requirements for artificial intelligence (AI) systems. AI chips from companies like Graphcore and Mythic are ASICs based on the novel, massively parallel architectures that maximize data processing capabilities for AI workloads. Others, like Intel, Nvidia, and AMD, are optimizing existing archite... » read more

AI Chip DFT Techniques For Aggressive Time-To-Market
By Mentor, a Siemens Business - 09 Apr, 2019 - Comments: 0

AI chips have aggressive time-to-market goals. Designers can shave significant time off of DFT and silicon bring up using the techniques described in this paper. Leading AI semiconductor companies have already had success with Tessent DFT tools. To read more, click here. » read more

Fast Local Registration Measurements For Efficient E-beam Writer Qualification And Correction
By KLA - 09 Apr, 2019 - Comments: 0

By Klaus-Dieter Roeth, Hendrik Steigerwald, Runyuan Han, Oliver Ache, Frank Laske (KLA-Tencor MIE GmbH, Germany) Abstract Mask data are presented which demonstrate local registration errors that can be correlated to the writing swathes of state-of-the-art e-beam writers and multi-pass strategies, potentially leading to systematic device registration errors versus design of close to 2nm. Fur... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy