category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Measuring Reflective Surfaces
By Subodh Kulkarni - 15 Jun, 2020 - Comments: 0

Manufacturers are adopting automated optical inspection (AOI) systems based on phase shift profilometry (PSP) for applications in advanced packaging processes. Many of these processes use front end-like techniques to create connections among die within a package and from the packaged die to the outside world. The technique offers fast, precise measurements of the 10µm to 100µm features that a... » read more

Liability And Reliability
By Ed Sperling - 09 Jun, 2020 - Comments: 0

As systems vendors accelerate the development of their own architectures, semiconductor companies across the supply chain are getting a seat at the table for architecting the engines in those systems. Rather than competing for a socket, they are directly involved in strategizing the optimal solution that can make a systems vendor or OEM more competitive or far more efficient. That gives the dev... » read more

Making Silicon Photonics Chips More Reliable
By Ed Sperling - 09 Jun, 2020 - Comments: 0

Silicon photonics has the ability to dramatically improve on-die and chip-to-chip communication within a package at extremely low power, but ensuring that signal integrity remains consistent over time isn't so simple. While this technology has been used commercially for at least the past decade, it never has achieved mainstream status. That's mostly due to the fact that Moore's Law scaling h... » read more

Using Fab Sensors To Reduce Auto Defects
By Anne Meixner - 09 Jun, 2020 - Comments: 0

The semiconductor manufacturing ecosystem has begun collaborating on ways to effectively use wafer data to meet the stringent quality and reliability requirements for automotive ICs. Silicon manufacturing companies are now leveraging equipment and inspection monitors to proactively identify impactful defects prior to electrical test. Using machine learning techniques, they combine the monitor ... » read more

Semiconductor Professionals On Working From Home
By Marie Ryan - 09 Jun, 2020 - Comments: 0

With most of the world still in lockdown, we thought we’d find out how different people in the semiconductor industry are dealing with the coronavirus. Carl Moore, Yield Management Specialist, yieldHUB How has Covid-19 affected your work life? Much of my work is remote, but Covid-19 affects in-person interactions with customers, which is always important. Video conferencing is critical in ... » read more

Challenges In Making Better Medical Sensors
By SE Staff - 09 Jun, 2020 - Comments: 0

Now that COVID-19 pandemic has desensitized us to telemedicine and more at-home health monitoring, the way we receive health care probably has changed for good. The no-touch thermometer and our personal pulse oximeter are not just coveted gadgets now. They have true clinical use in what may become a “point-of-use” system. Point of use means we don’t have to go to the clinic to get screene... » read more

Probe Expertise For Cryogenic Devices
By Thomas Funke - 09 Jun, 2020 - Comments: 0

The promise of quantum computing to solve complex problems far beyond today’s supercomputer capabilities, plus the emergence of high performance image sensors for security, military, and health care use, and other emerging applications are driving the need for test and measurement tools that can operate in extreme low temperatures (below about -150°C down to a few degrees above absolute zero... » read more

Figuring Out Binary Datalog Formats Without A Specification
By yieldHUB - 08 Jun, 2020 - Comments: 0

Being in the realm of semiconductor data with a wide range of customers, companies often throw interesting technical challenges at us. The most complex one so far this year is probably a request (OK, a requirement!) to interpret binary test datalog files so that they can then be analysed from our yieldHUB database system. The company provided us with little information on the actual binary form... » read more

NanoResolution MRS Sensor Delivers Fast, Precise 3D Inspection And Measurement For Advanced Semiconductor Packaging Applications
By CyberOptics - 08 Jun, 2020 - Comments: 0

The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels to achieve faster connections, higher bandwidth and lower power consumption. As packaging technologies have evolved, manufacturers have adapted old processes and adopted new processes to connect chips to each other and to the outside world. Often these new process... » read more

IEEE S3S 2019 — Characterization Challenges And Solutions For FDSOI Technologies
By PDF Solutions - 08 Jun, 2020 - Comments: 0

FDSOI technology has been proposed as an alternative device scaling path which offers benefits of tunable, superior electrostatics transistor while maintaining simplicity of planar integration. New device type and integration elements brought up challenges in device and process characterization and monitoring across the whole lifecycle of the technology. This paper presents successful applicati... » read more

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