Chip Industry Technical Paper Roundup: Feb. 24


New technical papers recently added to Semiconductor Engineering’s library: [table id=525 /] Find more semiconductor research papers here. » read more

Research Bits: Feb. 24


Growing patterned diamond Researchers from Rice University developed a bottom-up microwave plasma chemical vapor deposition method for growing patterned diamond surfaces that could help decrease operating temperatures in electronics by 23 degrees Celsius. The team used two techniques for controlling seed crystal placement. Photolithography was used for small, detailed patterns. To scale up ... » read more

Research Bits: Feb. 17


Analog layout foundation model Researchers from Pohang University of Science and Technology (POSTECH) built a foundation model for automated analog circuit layout. The team used a self-supervised learning approach, in which the model learns without human-provided labels. To counter a lack of available training data, the team divided analog layouts into small patches, masked part of each lay... » read more

Chip Industry Technical Paper Roundup: Feb. 16


New technical papers recently added to Semiconductor Engineering’s library: [table id=523 /] Find more semiconductor research papers here. » read more

Chip Industry Technical Paper Roundup: Feb. 9


New technical papers recently added to Semiconductor Engineering’s library: [table id=521 /] Find more semiconductor research papers here. » read more

Research Bits: Feb. 9


Computing with heat Researchers from the Massachusetts Institute of Technology (MIT) designed silicon structures that can perform calculations in an electronic device using excess heat instead of electricity. The device was created using a software system that automatically designs a material that can conduct heat in a specific manner. The inverse design technique allowed the researchers to... » read more

Research Bits: Feb. 3


Artificial synapse Researchers from Ulsan National Institute of Science and Technology (UNIST) designed a biodegradable, energy efficient artificial synapse that uses a layered structure made from naturally-derived polymers that break down naturally within 16 days in soil. "The device is built like a tiny sandwich, with ion-active layers separated by an ion-binding layer made from cellulose... » read more

Chip Industry Technical Paper Roundup: Feb. 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=519 /] Find more semiconductor research papers here. » read more

Research Bits: Jan. 27


Analog in-memory compute Researchers from Politecnico di Milano, Peking University, and Hewlett Packard Labs developed a Closed-Loop In-Memory Computing (CL-IMC) chip to reduce data movement between memory and processor. The fully integrated analog accelerator uses two 64×64 arrays of programmable SRAM cells along with integrated components including operational amplifiers and analog-to-di... » read more

Chip Industry Technical Paper Roundup: Jan. 27


New technical papers recently added to Semiconductor Engineering’s library: [table id=517 /] Find more semiconductor research papers here. » read more

← Older posts Newer posts →