Chip Industry Technical Paper Roundup: Feb. 24

Carrier mapping in sub‑2nm; CNN-to-edge HLS; sandpaper for atomic-precision surface finishing; LLM chip design education; nanolaser with extreme dielectric confinement; germanium-tin alloy semiconductors; low-voltage nanoscale MoS2 memristors; scaling routers with in-package optics and HBM4; RISC-V security.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Carrier Mapping in Sub-2nm Node Nanosheet Transistors with Scanning Spreading Resistance Microscopy imec and KU Leuven
An Automated CNN-to-Edge MLIR HLS framework TU Dresden
Carbon nanotube sandpaper for atomic-precision surface finishing KAIST
From RTL to Prompt Coding: Empowering the Next Generation of Chip Designers through LLMs RPTU University of Kaiserslautern-Landau
A nanolaser with extreme dielectric confinement DTU
High Pressure and Compositionally Directed Route to a Hexagonal GeSn Alloy Class University of Edinburgh et al.
Integration of Low-Voltage Nanoscale MoS2 Memristors on CMOS Microchips RWTH Aachen and Forschungszentrum Jülich
Scaling Routers with In-Package Optics and HBMs Technion, UC Berkeley and UC San Diego
Automatic Discovery of User-exploitable Architectural Security Vulnerabilities in Closed-Source RISC-V CPUs CISPA

Find more semiconductor research papers here.



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