Scalable spintronics manufacturing; cross-layer techniques; 3DIC metal bonding; memristor-based ANNs; shift register-in-memory; cache coherence; graphite film as a EUV pellicle; virtual prototyping for packaging; cross-bar based CIM for neural networks; AMS circuit learning.
New technical papers recently added to Semiconductor Engineering’s library:
Technical Paper | Research Organizations |
---|---|
Scalable Spintronics Manufacturing Process Sputtered L10-FePd and its Synthetic Antiferromagnet on Si/SiO2 Wafers for Scalable Spintronics |
University of Minnesota and NIST, with funding by DARPA and others |
MetaSys: A Practical Open-Source Metadata Management System to Implement and Evaluate Cross-Layer Optimizations | University of Toronto, ETH Zurich, and Carnegie Mellon University (Best Paper winner) |
Toward Single-Cell Multiple-Strategy Processing Shift Register Powered by Phase-Change Memory Materials |
Singapore University of Technology and Design and University of Cambridge |
ReMeCo: Reliable Memristor-Based in-Memory Neuromorphic Computation | Eindhoven University of Technology, University of Tehran, and USC |
Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration With μLED | Tohoku University (Japan) |
TAG: Learning Circuit Spatial Embedding From Layouts | UT Austin and NVIDIA |
WARDen: Specializing Cache Coherence for High-Level Parallel Languages | Northwestern University and Carnegie Mellon University |
Graphite Pellicle: Physical Shield for Next-Generation EUV Lithography Technology | University of Ottawa, Sungkyunkwan University, and Hanbat National University |
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies | Fraunhofer ENAS |
Compute in-Memory with Non-Volatile Elements for Neural Networks: A Review from a Co-Design Perspective | Argonne National Lab, Purdue University, and Indian Institute of Technology Madras |
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