Enabling electrical and thermal performance enhancements while maintaining the manufacturing efficiency and scalability of the MLF leadframe technology.
Abstract
“The demand for cost-effective leadframe packages continues to grow, particularly for automotive and commercial applications. These designs require smaller form factors, enhanced thermal and electrical performance, and proven reliability. Flip chip on leadframe technology offers significant advantages over traditional wire-bonded MicroLeadFrame (MLF) and high-cost laminate Flip Chip Chip Scale Package (fcCSP) designs, including enhanced thermal and electrical characteristics and reduced package size compared to traditional wirebond solutions such as MLF. As industry standards push for cost effective solutions targeting thinner and more compact profiles than available in wirebond solutions, flip chip technology enables die size reduction and printed circuit board (PCB) area savings compared to conventional wire-bonded MLF packages. The use of copper (Cu) pillar bumps supports fine-pitch designs and offers flexibility for fan-in leadframe configurations. The flip chip MicroLeadFrame (fcMLF) package presents a compelling solution for a wide range of applications, including power management integrated circuits (PMICs), DC/DC converters, and RF switches. As with a traditional MLF package, Amkor’s wettable flank feature, both dimple and step-cut configurations can be supported. A requirement of the automotive industry, the wettable flank enhancement enables Automated Optical Inspection (AOI) for proper fillet formation during the Printed Circuit Board (PCB) solder reflow process without requiring an expensive and complex through board X-Rays process. By leveraging industry-leading flip chip interconnect technology and an established sawn MLF manufacturing process, fcMLF packaging delivers a cost-effective, high performance leadframe packaging solution tailored to meet the evolving needs of modern electronic systems.”
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