Light In A Package


Silicon photonics is gaining significant traction inside the data center, but creating a simpler method of packaging the laser with other circuitry remains a stumbling block for cutting costs and using this technology across a wider swath of applications. Progress does appear to be on the horizon, even though exact time frames remain unclear. The advantages of light in communications are wel... » read more

Multi-Physics Combats Commoditization


The semiconductor industry has benefited greatly from developments around digital circuitry. Circuits have grown in size from a few logic gates in the 1980s to well over 1 billion today. In comparison, analog circuits have increased in size by a factor of 10. The primary reason is that digital logic managed to isolate many of the physical effects from functionality, and to provide abstractions ... » read more

Get Ready For In-Mold Electronics


Imagine inserting the electronics into a product without using a printed circuit board, a module, or even a system-in-package. That's the promise of in-mold electronics (IME), a technology that has been around for years, but which is just beginning to see wider adoption. The technology is related to conductive inks and transparent conductive films. The IME manufacturing process is said to pr... » read more

Executive Insight: Lip-Bu Tan


Semiconductor Engineering sat down with Lip-Bu Tan, president and CEO of [getentity id="22032" e_name="Cadence"], to discuss disruptions and changes in the semiconductor industry, from machine learning and advance packaging to tools and business. What follows are excerpts of that conversation. SE: What do you see as the next big thing? Tan: Unlike mobility or cell phones, or PCs before th... » read more

IP Biz Changes As Markets Fragment


Semiconductor Engineering sat down to discuss IP protection, tracking and reuse with Srinath Anantharaman, CEO of [getentity id="22203" e_name="ClioSoft"]; Jeff Galloway, CTO of Silicon Creations; Marc Greenberg, group director of product marketing for [getentity id="22032" e_name="Cadence"]'s IP Group; and John Koeter, vice president of marketing for [getentity id="22035" e_name="Synopsys"]' S... » read more

Is Design Innovation Slowing?


Paul Teich, principal analyst for Tirias Research, gave a provocative talk at the recent DAC conference entitled, "Is Integration Leaving Less Room for Design Innovation?" The answer isn't as simple as the question might suggest. "Integration used to be a driver for increasing the functionality of silicon," Teich said. "Increasingly, it will be used to incorporate more features of an entire ... » read more

Packaging Enters New Phase


The race is on to make advanced packaging less expensive than shrinking everything down onto the same die—much less expensive, in fact. Following several years of speculation and rather shaky market predictions at the beginning of this decade, packaging houses and foundries spent the last four years proving that packaging really does provide a viable alternative to shrinking die in terms o... » read more

Solving The Design And Verification Challenges Of High Density Advanced Packaging


This paper discusses ways in which design teams can apply silicon (IC) type processes to the design and verification of the emerging HDAP packages. High Density Advanced Packaging, or HDAP, is the next-generation architecture for increased functional density, higher performance, lower power, smaller PCB footprints, and thinner profiles. This new “breed” of disruptive packaging technology... » read more

Is 7nm The Last Major Node?


A growing number of design and manufacturing issues are prompting questions about what scaling will really look like beyond 10/7nm, how many companies will be involved, and which markets they will address. At the very least, node migrations will go horizontally before proceeding numerically. There are expected to be more significant improvements at 7nm than at any previous node, so rather th... » read more

What Does An IoT Chip Look Like?


By Ed Sperling and Jeff Dorsch Internet of Things chip design sounds like a simple topic on the face of it. Look deeper, though, and it becomes clear there is no single IoT, and certainly no type of chip that will work across the ever-expanding number of applications and markets that collectively make up the IoT. Included under this umbrella term are sensors, various types of processors, ... » read more

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