tag: Cadence

How To Shorten Hardware-Software Development Cycles
By Frank Schirrmeister - 24 Apr, 2014 - Comments: 0

Doing more hardware-software development prior to silicon promises significant productivity and time-to-market improvements. Part of this is shifting software development “to the left,” which can compress development Last month, I blogged about “The Great Shift to the Left,” and I pointed out some of the organizational challenges associated with compressing the development cycle usin... » read more

Hierarchical Timing Analysis: Pros, Cons, And A New Approach
By Various Writers - 23 Apr, 2014 - Comments: 0

As digital semiconductor designs continue to grow larger, designers are looking to hierarchical methodologies to help alleviate huge runtimes. This approach allows designers to select and time certain blocks of logic, generating results more quickly and with fewer memory resources. However, these benefits come at the cost of accuracy. This paper covers the pros and cons of different hierarchica... » read more

Blog Review: April 23
By Ed Sperling - 23 Apr, 2014 - Comments: 0

Mentor’s John Day looks backward through a smart rearview mirror from Nissan. No glare, even at night or at sunset, and a wider field of vision. You have to wonder why this technology took so long. Synopsys’ Karen Bartleson wonders when the IoT will actually arrive, given the delay in durable goods, a concern over security and the effects of government regulation. Answer: When we stop ta... » read more

Cadence Gobbles Up Jasper
By Brian Bailey - 21 Apr, 2014 - Comments: 4

2012 was the year that everyone remembers Synopsys going on an acquisition binge, but 2014 will go down as the year that Cadence Design Systems decided that EDA was worth investing in. Rather than placing investment bets outside of its core competence, Cadence bought Forte in February and now adds Jasper Design Automation to its fold. Jasper started life as Tempus Fugit in 1999 and became Ja... » read more

The Week In Review: Design
By Ed Sperling - 18 Apr, 2014 - Comments: 0

Certifications TSMC certified Mentor Graphics’ DFM, place and route and custom IC tools, as well as its SPICE simulator, for the 16nm finFET process.  The foundry also certified Cadence’s digital and custom/analog tools for that process, including physical verification, QRC extraction, timing sign off and its power integrity solution. And it certified Synopsys’ digital and custom soluti... » read more

Blog Review: April 16
By Ed Sperling - 16 Apr, 2014 - Comments: 0

Cadence’s Richard Goering attended a workshop on “extreme” scale design automation, which looked at where else EDA tools can be used—such as intelligent traffic lights. At least there are well-defined use cases. Mentor’s Nazita Saye has compiled five predictions from the 1964 New York World’s Fair that are worth revisiting. Three of them came true. Check out the ones that didn’... » read more

A Guide To Advanced Process Design Kits
By Ernest Worthman - 14 Apr, 2014 - Comments: 1

The increasing complexity of design enablement has prompted manufacturers to optimize the design process. New tools and techniques, thanks to next-generation hardware and software, have provided a new platform for semiconductor and wafer design. Advanced PDKs are the solution and have been developed by foundries to optimize the design process and leverage and reuse intellectual property (IP) an... » read more

Power Moves Up To First Place
By Ed Sperling - 10 Apr, 2014 - Comments: 2

Virtually every presentation delivered about semiconductor design or manufacturing these days—and every end product specification that uses advanced technology—incorporates some reference to power and/or energy. It has emerged as the most persistent, most problematic, and certainly the most talked about issue from conception to marketplace adoption. And the conversation only grows louder... » read more

Platforms, Standards, Methodologies Conquer Design Challenges
By Brian Fuller - 10 Apr, 2014 - Comments: 0

We in the electronics design world always have spent a lot of time wringing our hands (will we ever get to design below 1 micron??) And while the problems are not imagined—they’re often soberingly real—we tend to plow through them, or, when necessary around them. Today, amid increasing complexity and risk, we’re leveraging platforms, standards and new methodologies to slay these d... » read more

Pain Management
By Ed Sperling - 10 Apr, 2014 - Comments: 0

In part one of this series, the focus was on overlapping and new pain points in the semiconductor flow, from initial conception of what needs to be in a chip all the way through to manufacturing. Part two looks at how companies are attempting to manage that pain. It’s no secret that [getkc id="81" kc_name="SoC"]s are getting more complicated to design, debug and build, but the complexity i... » read more

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