tag: GlobalFoundries

10nm Fab Challenges
By Mark LaPedus - 21 May, 2015 - Comments: 1

After a promising start in 2015, the semiconductor equipment industry is currently experiencing a slight lull. The pause is expected to be short-lived, however. Suppliers of [getkc id="208" comment="3D NAND"] devices are expected to add more fab capacity later this year. And about the same time, foundries are expected to order the first wave of high-volume production tools for 10nm. At 10nm... » read more

The Bumpy Road To 10nm FinFETs
By Mark LaPedus - 21 May, 2015 - Comments: 0

Foundry vendors are currently ramping up their 16nm/14nm [getkc id="185" kc_name="finFET"] processes in the market. Vendors are battling each other for business in the arena, although the migration from planar to finFETs is expected to be a slow and expensive process. Still, despite the challenges at 16nm/14nm, vendors are gearing up for the next battle in the foundry business—the 10nm nod... » read more

Waiting For Next-Gen Metrology
By Mark LaPedus - 21 May, 2015 - Comments: 0

Chipmakers continue to march down the various process nodes, but the industry will require new breakthroughs to extend IC scaling at 10nm and beyond. In fact, the industry will require innovations in at least two main areas—patterning and the [getkc id="36" comment="Interconnect"]. There are other areas of concern, but one technology is quickly rising near the top of the list—metrology.... » read more

10nm Fab Watch
By Mark LaPedus - 21 May, 2015 - Comments: 1

When will the 10nm logic node happen? Analysts believe that foundry vendors will move into 10nm finFET volume production around 2017. Still others say the 10nm finFET ramp could take place anywhere from 2018 to 2020. The predictions are all over the map. One way to predict the timing, progress and demand for 10nm is simple: Follow the fabs. In fact, Intel, Samsung, TSMC and GlobalFound... » read more

Tech Talk: 14nm
By Ed Sperling - 21 May, 2015 - Comments: 0

Tamer Ragheb, digital design methodology technical lead at GlobalFoundries about what's changed with 14nm finFETs, including coloring with double patterning, new corners, Miller Effects, timing issues and variability. [youtube vid=Yk6jSKCtsjU] » read more

One-On-One: Thomas Caulfield
By Mark LaPedus - 21 May, 2015 - Comments: 0

Semiconductor Engineering sat down to talk about fabs, process technology and the equipment industry with Thomas Caulfield, senior vice president and general manager of Fab 8 at [getentity id="22819" comment="GlobalFoundries"]. Located in Saratoga County, N.Y., Fab 8 is GlobalFoundries’ most advanced 300mm wafer fab. What follows are excerpts of that discussion. SE: Last year, GlobalFoundr... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 May, 2015 - Comments: 0

Investment firm TIG Advisors, a stockholder of Altera, has urged stockholders to vote against Altera’s lead independent director to the board. TIG also contends that Altera has failed stockholders by rejecting a recent acquisition bid from Intel. Altera’s 14nm foundry partner is Intel, while TSMC handles the 20nm and above foundry work. Soon, Altera will choose a 10nm foundry partner. “Sh... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 May, 2015 - Comments: 0

After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. Now, Applied Materials and TEL are separately re-grouping, and are back to where they originally started as competitors in the fab tool market. Applied Materials held a conference call to explain the situation with TEL. Applied Materials... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Apr, 2015 - Comments: 0

For years, Altera’s sole foundry was TSMC. Then, not long ago, Altera selected Intel as its foundry partner for 14nm. TSMC still handles 20nm and above work for Altera. This quarter, Altera was supposed to select a foundry partner for 10nm. This week, Altera posted lackluster results in the quarter. Altera did not elaborate on its 10nm plans, nor did it discuss the Intel rumors. "Altera did n... » read more

Manufacturing Bits: April 21
By Mark LaPedus - 21 Apr, 2015 - Comments: 0

Fan-out packaging consortium A*STAR’s Institute of Microelectronics (IME) and others have formed a high-density fan-out wafer level packaging (FOWLP) consortium in Singapore. Others in the group include Amkor, Nanium, STATS ChipPAC, NXP, GlobalFoundries, Kulicke & Soffa, Applied Materials, Dipsol Chemicals, JSR, KLA-Tencor, Kingyoup Optronics, Orbotech and Tokyo Ohka Kogyo (TOK). T... » read more

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