tag: Lam Research

Backside Power Delivery as a Scaling Knob for Future Systems
By Coventor - 14 Aug, 2019 - Comments: 0

Standard cell track height scaling provides us with sufficient area scaling at the standard cell library level. The efficiency of this technique and the complexities involved with this scaling method have been discussed in detail. However, the area benefits of standard cell track height scaling diminish when we consider the complexities of incorporating on-chip power grid into the DTCO explorat... » read more

Blog Review: Aug. 14
By Jesse Allen - 14 Aug, 2019 - Comments: 0

Cadence's Paul McLellan digs into Mary Meeker's analysis of Internet trends, from growth of the Inernet as a whole to cyber attacks, online finance, and the gig economy. Synopsys' Taylor Armerding warns that the financial services industry is aware of cybersecurity threats, but isn't doing enough to protect its networks and data. Mentor's Colin Walls considers a few cases where writing in... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Aug, 2019 - Comments: 0

Fab tools Lam Research has rolled out two new tools for use in the production of 3D NAND. The first tool, called the VECTOR DT, is geared for backside deposition. The second system, the EOS GS, is a wet etch tool for film removal on backside and bevel. Designed to control the wafer bow in 3D NAND manufacturing, the VECTOR DT system is the latest addition to Lam’s plasma-enhanced chemical ... » read more

Process Window Optimization
By Ed Sperling - 07 Aug, 2019 - Comments: 0

David Fried, vice president of computational products at Lam Research, examines increasing process variation and interactions between various types of variation, why different approaches are necessary to improve yield and continue scaling. » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Aug, 2019 - Comments: 0

Trade wars Talks between the United States and China continue to stall and the two nations are still embroiled in a trade war. So this week, U.S. President Donald Trump would like to impose a 10% tariff on the remaining $300 billion list of China-based imports starting Sept. 1, according to a report from Reuters. This in turn will impact the electronics and IC industries. In response to the... » read more

Cloudy Outlook Seen For IC Biz
By Mark LaPedus - 29 Jul, 2019 - Comments: 0

After a slowdown in the first half of 2019, chipmakers and equipment vendors face a cloudy outlook for the second half of this year, with a possible recovery in 2020. Generally, the semiconductor industry began to see a slowdown starting in mid- to late-2018, which extended into the first half of 2019. During the first half of this year, memory and non-memory vendors were negatively impacted... » read more

Node Within A Node
By Ed Sperling - 24 Jul, 2019 - Comments: 0

Enough margin exists in manufacturing processes to carve out the equivalent of a full node of scaling, but shrinking that margin will require a collective push across the entire semiconductor manufacturing supply chain. Margin is built into manufacturing at various stages to ensure that chips are manufacturable and yield sufficiently. It can include everything from variation in how lines are... » read more

200mm Cools Off, But Not For Long
By Mark LaPedus - 18 Jul, 2019 - Comments: 4

After years of acute shortages, 200mm fab capacity is finally loosening up, but the supply/demand picture could soon change with several challenges on the horizon. 200mm fabs are older facilities with more mature processes, although they still churn out a multitude of today’s critical chips, such as analog, MEMS, RF and others. From 2016 to 2018, booming demand for these and other chips ca... » read more

Process Modeling Exploration for 8 nm Half-Pitch Interconnects
By Coventor - 17 Jul, 2019 - Comments: 0

In this paper, we simulate eSADP, eSAQP and iSAOP patterning options to enable fabrication of 8 nm Half-Pitch (HP) interconnects. We investigate the impact of process variations and patterning sensitivities on pitch walking and resistance performance. The overall yield is also calculated for eight line CDs as well as M2-via-M1 via segment resistance and compared for all options. Process sensiti... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Jul, 2019 - Comments: 0

Semi takeover targets Semiconductor M&A activity is heating up again. So who is next? “Within our coverage universe, we believe AMBA (Ambarella) and SLAB (Silicon Labs) represent the most likely targets moving forward,” according to KeyBanc in a research note. KeyBanc also listed some other “M&A Combinations That Could Make Sense.” Some of these combos make sense, while othe... » read more

← Older posts Newer posts →

  • Sponsors

  • Standards/Organizations

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy