tag: Lam Research

The Race To 10/7nm
By Mark LaPedus - 22 May, 2017 - Comments: 4

Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies. The current iterations of 10nm and 7nm technologies are scaled versions of today’s 16nm/14nm finFETs with traditional copper interconnects, high-k/metal-gate and low-k diele... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 May, 2017 - Comments: 0

Market research Intel retained its No. 1 position as the largest semiconductor manufacturer and grew its semiconductor revenue 4.6% in 2016, according to Gartner. Samsung Electronics continued to maintain the No. 2 spot with 11.7% market share. The largest mover in the top 25 was Broadcom, which moved up 12 places in the market share ranking, according to the firm. Worldwide silicon wafer a... » read more

200mm Crisis?
By Mark LaPedus - 18 May, 2017 - Comments: 7

Over the last year or so, the IC industry has experienced an acute shortage of both 200mm fab capacity and 200mm equipment amid a surge of demand for certain chips. Right now, though, the 200mm shortfall is much worse than before. But this situation isn’t expected to improve for both elements in the second half of 2017, and perhaps beyond. On the capacity front, chipmakers are generally... » read more

What Drives SADP BEOL Variability?
By Michael Hargrove - 18 May, 2017 - Comments: 0

Until EUV lithography becomes a reality, multiple patterning technologies such as triple litho-etch (LELELE), self-aligned double patterning (SADP), and self-aligned quadruple patterning (SAQP) are being used to meet the stringent patterning demands of advanced back-end-of-line (BEOL) technologies. For the 7nm technology node, patterning requirements include a metal pitch of 40nm or less. This ... » read more

A Look At Atomic Layer Deposition
By Lam Research - 18 May, 2017 - Comments: 0

Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition (ALD) is a reality. In fact, it’s being used in an ever-increasing number of applications as an extremely precise and controllable process for creating thin films. Together with its etch counterpart – atomic layer etching (ALE) – ALD is enabling the us... » read more

Blog Review: May 17
By Jesse Allen - 17 May, 2017 - Comments: 0

Synopsys' Robert Vamosi digs into last Friday's massive ransomware infection that impacted the UK health system, a Spanish telecom, and many other organizations running unpatched Windows – and whether there's a second version out there. Cadence's Paul McLellan reports on the latest developments and future of FD-SOI from the SOI Silicon Valley Symposium. Mentor's Joe Hupcey III chats wit... » read more

The Week In Review: IoT
By Jeff Dorsch - 12 May, 2017 - Comments: 0

Conferences The Internet of Things World conference is on tap next week at the Santa Clara Convention Center in Silicon Valley. There will be more than 250 exhibitors on the show floor, with 11,000 attendees expected. More than 400 speakers will make presentations over three days, May 16-17-18. ON Semiconductor will have a number of IoT-related products to demonstrate at its booth, including i... » read more

Blog Review: May 3
By Jesse Allen - 03 May, 2017 - Comments: 0

Cadence's Paul McLellan shares highlights from a recent IRDS panel, including changing the assumptions about computing and looking for the next "killer app." Synopsys' Meenakshy Ramachandran introduces the array of improvements in HDMI 2.1, from higher bandwidth to Dynamic HDR. Mentor's Minghui Fan checks out advancements in optical proximity correction and resolution enhancement technolo... » read more

Inside Lithography And Masks
By Mark LaPedus - 01 May, 2017 - Comments: 1

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="IMEC"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cov... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 21 Apr, 2017 - Comments: 0

Fab tool vendors In the wafer fab equipment (WFE) rankings, Applied Materials was the leader in terms of market share in 2016, according to Gartner. For WFE, Lam Research jumped from fourth place in 2015 to second place in the rankings in 2016, according to Gartner. ASML was third, followed by TEL. Meanwhile, VLSI Research recently released its ranking for both front-end and backend equipment.... » read more

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