tag: Mentor

Blog Review: August 27
By Jesse Allen - 27 Aug, 2025 - Comments: 0

Cadence's Pamula Sai Srinivas explains why clock tree synthesis is essential to ensuring that the clock signal is distributed in a way that helps achieve timing closure and maintain synchronization, performance, and reliability. Synopsys' Sajani Patel, Varun Agrawal, and Manuel Mota check out what's new in UCIe 3.0, including doubling the maximum data rate to 64 GT/s, runtime recalibration, ... » read more

Manufacturing At The Limits
By Gregory Haley - 21 Aug, 2025 - Comments: 2

Hybrid bonding has been in production for several years, with mature flows capable of delivering robust yields using 10µm interconnects. At that scale, processes can tolerate hundreds of nanometers of overlay variation, modest differences in wafer bow, and particle sizes rivaling the interconnect height without catastrophic impact. Hybrid bonding is compatible with optical metrology, existing ... » read more

Blog Review: August 20
By Jesse Allen - 20 Aug, 2025 - Comments: 0

Cadence's Sriram Sharma Kalluri finds that time-of-flight sensors are poised to revolutionize ADAS by generating precise 3D point clouds that, particularly when combined with lidar, contribute to an exceptionally accurate and comprehensive understanding of the vehicle's surroundings. Synopsys' Igor Markov and other industry experts discuss how quantum computing is moving from research to p... » read more

Best Options For Using AI In Chip Design
By Ed Sperling - 20 Aug, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how and where AI can be applied to chip design to maximize its value, and how that will impact the design process, with Chuck Alpert, Cadence Fellow; Sathish Balasubramanian, head of product marketing and senior director for custom IC at Siemens EDA; Anand Thiruvengadam, senior director and head of AI product management at S... » read more

Launching The Full Potential Of 3D IC With Front-End Architectural Planning
By Siemens EDA - 19 Aug, 2025 - Comments: 0

3D IC and chiplet-based design have the potential to accelerate the pace of semiconductor industry innovation. 3D IC design teams pack more functionality closer together and achieve higher levels of systems integration and performance in a smaller footprint faster than what’s possible with traditional SoC implementation. To achieve the full potential of 3D IC, teams need cost-effective fro... » read more

Complex Mix Of Processors At The Edge
By Liz Allan - 18 Aug, 2025 - Comments: 1

With AI changing so fast, it’s a juggle for companies to ensure they can deliver the best performance now while also future-proofing for unknown AI models or a completely different approach to training and inference that may emerge. There are a slew of options for high-end and budget phones, hyperscalers, and low-cost, low-power edge devices, and while GPUs keep making headlines, many designe... » read more

Chip Industry Week in Review
By The SE Staff - 15 Aug, 2025 - Comments: 0

Lines are blurring between government and industry: On the heels of last week's resignation demand, Intel CEO Lip-Bu Tan met with President Trump on Monday, with the President later saying, "The meeting was a very interesting one. His success and rise is an amazing story."  Now, Bloomberg reports the Trump administration is in talks with Intel for the U.S. government to take a stake in th... » read more

Moving Past “It Works” — Intelligent Optimization Is the Key to PCB Excellence
By Shivani Joshi - 14 Aug, 2025 - Comments: 0

In the fast-evolving field of electronic systems design, engineers are under increasing pressure to deliver innovative, high-performance products within ever-shrinking development cycles. Traditional methods—relying on intuition, trial-and-error testing, and even basic simulation—struggle to keep pace with the growing complexity of modern systems. Nowhere is this more evident than in printe... » read more

Reliable Training Data Paramount To AI Model Success
By Ann Mutschler - 14 Aug, 2025 - Comments: 0

AI systems are increasingly being integrated into safety- and mission-critical applications ranging from automotive to health care and industrial IoT, stepping up the need for training data that is reliable, secure, and which is generated from trusted sources. AI activity is growing exponentially, as everybody tries to figure out how to apply it to their domain, application, or workload. In ... » read more

Chiplet Interfaces Embrace Failures
By Anne Meixner - 12 Aug, 2025 - Comments: 0

Redundancy in chiplet interfaces is now a prerequisite for achieving sufficient yield in high-performance computing devices, which today are packed with tens of thousands of interconnects. And as the number and density of those interconnects increases, the prospects for yield only worsen. For more than two decades, high-speed I/O interfaces have included reliability strategies to manage in-f... » read more

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