Digital Twins Target IC Tool And Fab Efficiency

By Laura Peters - 21 Mar, 2024 - Comments: 0

Digital twins have emerged as the hot "new" semiconductor manufacturing technology, enabling fabs to create a virtual representation of a physical system on which to experiment and optimize what's going on inside the real fab. While digital twin technology has been in use for some time in other industries, its use has been limited in semiconductor manufacturing. What's changing is the breadt... » read more

3D-IC Intensifies Demand For Multi-Physics Simulation

By Ann Mutschler - 20 Mar, 2024 - Comments: 0

The introduction of full 3D-ICs will require a simultaneous analysis of various physical effects under different workloads, a step-function change that will add complexity at every step of the design flow, expand and alter job responsibilities, and bring together the analog and digital design worlds in unprecedented ways. 3D-ICs will be the highest-performance advanced packaging option, in s... » read more

Blog Review: March 20

By Jesse Allen - 20 Mar, 2024 - Comments: 0

Synopsys' Kiran Vittal delves into AI chips, including the expansion of chip design beyond traditional semiconductor companies, adoption of RISC-V, and the use of formal equivalence checking to verify complex AI datapaths. Siemens' Patrick McGoff points to a survey that suggests projects deploying design for manufacturing within a PCB design flow are more likely to be completed on-time, on-q... » read more

Optimizing Energy At The System Level

By Brian Bailey - 18 Mar, 2024 - Comments: 0

Power is a ubiquitous concern, and it is impossible to optimize a system's energy consumption without considering the system as a whole. Tremendous strides have been made in the optimization of a hardware implementation, but that is no longer enough. The complete system must be optimized. There are far reaching implications to this, some of which are driving the path toward domain-specific c... » read more

Chip Industry Week In Review

By The SE Staff - 15 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. Europe's semiconductor footprint is growing in areas that previously had little association with chips. Silicon Box plans to build a panel-level foundry in northern Italy, funded in part by the Italian government. The deal is worth around €3.2 billion ($3.6B). In addition, imec will establish a specialized 300mm chip technology pilot line in M... » read more

The City In The Tower: 3D ICs Transform The Electronics System Landscape

By Keith Felton - 14 Mar, 2024 - Comments: 0

By Keith Felton and Todd Burkholder The time of 3D integrated circuits (3D ICs) is here, and they will revolutionize the semiconductor industry and effect a watershed in the nature of electronics products that can be designed and manufactured. Yet again—as with personal computers, the internet, and smart phones—our increasingly digital world will never be the same. 3D IC architectures... » read more

The Rising Price Of Power In Chips

By Ed Sperling - 14 Mar, 2024 - Comments: 0

Power is everything when it comes to processing and storing data, and much of it isn't good. Power-related issues, particularly heat, dominate chip and system designs today, and those issues are widening and multiplying. Transistor density has reached a point where these tiny digital switches are generating more heat than can be removed through traditional means. That may sound manageable e... » read more

Blog Review: Mar. 13

By Jesse Allen - 13 Mar, 2024 - Comments: 0

Cadence's Geeta Arora explains the Address Translation Service in PCIe 6.0, which allows an I/O device to perform its own virtual to physical address translations without relying on the host's CPU to reduce latency and improve overall system performance. Synopsys' John Swanson, Jon Ames, Priyank Shukla, and Varun Agrawal highlight the upcoming 1.6T iteration of the Ethernet standard and the ... » read more

Security Is Critical For Commercial Chiplets

By Ann Mutschler - 13 Mar, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the security issues and requirements in commercial chiplet ecosystem, with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA prod... » read more

Strategies For Detecting Sources Of Silent Data Corruption

By Anne Meixner - 12 Mar, 2024 - Comments: 0

Engineering teams are wrestling with how to identify the root causes of silent data corruption (SDC) in a timely and cost-effective way, but the solutions are turning out to be broader and more complex than simply fixing a single defect. This is particularly vexing for data center reliability, accessibility and serviceability (RAS) engineering teams, because even the best tools and methodolo... » read more

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tag: Mentor

Digital Twins Target IC Tool And Fab Efficiency

3D-IC Intensifies Demand For Multi-Physics Simulation

Blog Review: March 20

Optimizing Energy At The System Level

Chip Industry Week In Review

The City In The Tower: 3D ICs Transform The Electronics System Landscape

The Rising Price Of Power In Chips

Blog Review: Mar. 13

Security Is Critical For Commercial Chiplets

Strategies For Detecting Sources Of Silent Data Corruption

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