tag: Samsung Electronics

Week In Review: Design, Low Power
By Jesse Allen - 09 Dec, 2022 - Comments: 0

Tools, IP, design Codasip launched a new organization within the company to support the development and commercialization of technical innovations in key applications including security, functional safety, and AI/ML. "As semiconductor scaling is showing its limits, there is an obvious need for new ways of thinking. We will be working with universities, research institutes and strategic partner... » read more

Research Bits: Nov. 21
By Jesse Allen - 21 Nov, 2022 - Comments: 0

Graphene heater for phase-change switches Researchers from the University of Washington, Stanford University, Charles Stark Draper Laboratory, University of Maryland, and Massachusetts Institute of Technology designed an energy-efficient, silicon-based non-volatile switch that manipulates light through the use of a phase-change material and graphene heater. Aiming to reduce the power consum... » read more

Memory and Energy-Efficient Batch Normalization Hardware
By Technical Paper Link - 17 Nov, 2022 - Comments: 0

A new technical paper titled "LightNorm: Area and Energy-Efficient Batch Normalization Hardware for On-Device DNN Training" was published by researchers at DGIST (Daegu Gyeongbuk Institute of Science and Technology). The work was supported by Samsung Research Funding Incubation Center. Abstract: "When training early-stage deep neural networks (DNNs), generating intermediate features via con... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Nov, 2022 - Comments: 0

Chip design Fraunhofer IIS/EAS implemented the Bunch of Wires (BoW) standard-based interface IP from the Open Compute Project (OCP) on Samsung's 5nm technology. The effort is intended to make chiplets more feasible for products with small and medium-sized production runs and determine the need for additional uniform standards in the future, such as for die-to-die bonding. “As part of t... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 04 Nov, 2022 - Comments: 0

Earnings and Acquisitions Siemens will acquire Avery Design Systems, a simulation-independent verification IP supplier, in the first quarter of fiscal year 2023. The terms of the transaction were not disclosed. Siemens executives say the acquisition will “enhance Siemens’ offerings across mainstream verification IP segments, while further extending Siemens verification solutions into area... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 04 Nov, 2022 - Comments: 0

Nikkei Asia reports the U.S. is urging allies, including Japan, to restrict exports of advanced semiconductors and related technology to China. The U.S. holds 12% of the global semiconductor market, Japan has a 15% share, while Taiwan and South Korea each have about a 20% share. Some U.S. companies have called for other countries to adopt U.S.-style export curbs, arguing it is unfair for only A... » read more

Chip Industry Earnings: A Mixed Bag
By Linda Christensen - 28 Oct, 2022 - Comments: 0

Editor's Note: Updated the week of Oct. 31 and Nov. 7 for additional earnings releases. Although most companies reported revenue growth, this latest round of chip industry earnings releases reflected a few major themes: Lower future quarter guidance to varying degrees, due to the recent U.S. export restrictions related to China; Negative impact of the inflationary environment on corn... » read more

Improving Redistribution Layers for Fan-out Packages And SiPs
By Laura Peters - 15 Sep, 2022 - Comments: 1

Redistribution layers (RDLs) are used throughout advanced packaging schemes today including fan-out packages, fan-out chip on substrate approaches, fan-out package-on-package, silicon photonics, and 2.5D/3D integrated approaches. The industry is embracing a variety of fan-out packages especially because they deliver design flexibility, very small footprint, and cost-effective electrical connect... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 05 Aug, 2022 - Comments: 0

Pervasive computing, connectivity Semtech Corporation announced that it will acquire Sierra Wireless, an IoT services company. The acquisition will combine Semtech’s LoRa end nodes and cloud service with Sierra Wireless’ cellular capabilities. Telit will incorporate Thales’s cellular IoT products business under a new name Telit Cinterion, led by Telit. Telit Cinterion will be Californ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 15 Jul, 2022 - Comments: 0

Tools & IP Cadence will acquire Future Facilities, a provider of electronics cooling analysis and energy performance optimization solutions for data center design and operations using physics-based 3D digital twins. Future Facilities’ product portfolio includes an electronics thermal solution, as well as computational fluid dynamics (CFD) electronics cooling simulation technology that op... » read more

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