tag: Siemens

New Technologies To Support 3D-ICs
By Brian Bailey - 04 Sep, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

Week In Review: Design, Low Power
By Jesse Allen - 30 Aug, 2019 - Comments: 0

Rambus completed its acquisition of Northwest Logic, a supplier of memory, PCIe and MIPI digital controllers. The Hillsboro, OR office of Northwest Logic will remain in place, along with the entire staff. SureCore launched a new low power design service. The company's offering includes concept-to-tape-out low power mixed-signal design expertise such as design and layout capabilities, technol... » read more

Taking Energy Into Account
By Ann Mutschler - 28 Aug, 2019 - Comments: 1

Considering power throughout the SoC design flow is common practice. The same cannot be said for energy, although that is beginning to change as chips increasingly incorporate heterogeneous processing elements. Combined with this, AI/ML/DL technologies increasingly allow engineering teams to explore and optimize design data for more targeted and efficient systems. But this approach also requ... » read more

Blog Review: Aug. 28
By Jesse Allen - 28 Aug, 2019 - Comments: 0

Cadence's Paul McLellan takes a look at the numerous challenges in designing and manufacturing Cerebras' massive 400,000 processor, 1.2 trillion transistor chip. Synopsys' Taylor Armerding points to a lack of robust mobile app security and why building in security from the beginning can lead to greater productivity and cost saving. Mentor's Paul Johnston takes a look at what's in store at... » read more

EDA Gears Up For 3D
By Brian Bailey - 26 Aug, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

Fast LFD Flows With Pattern Matching And Machine Learning Can Deliver Higher-Yielding Designs Faster
By Wael elManhawy - 22 Aug, 2019 - Comments: 0

By Wael ElManhawy and Joe Kwan A lithographic (litho) hotspot is a defect on a wafer that is created during manufacturing by a combination of systematic process variation and resolution enhancement technology (RET) limitations. Litho hotspots typically represent severe yield detractors, so detecting and eliminating potential litho hotspots prior to manufacturing is crucial to achieving a com... » read more

Improving Verification Predictability And Efficiency Using Big Data
By Mentor, a Siemens Business - 21 Aug, 2019 - Comments: 0

By providing a Big Data infrastructure, with state of the art technologies, within the verification environment, the combination of all verification metrics allows all resources to be used as efficiently as possible and enables process improvements using predictive analysis. This paper covers the technology, the metrics, and the process, and it will explore a number of techniques enabled by suc... » read more

Blog Review: Aug. 21
By Jesse Allen - 21 Aug, 2019 - Comments: 0

Cadence's Paul McLellan considers the path to autonomous vehicles and the many barriers that stand in the way. Mentor's Colin Walls notes that the fundamental function of an RTOS is to give the developer control of time and points to some of the time oriented services that assist. Synopsys' Taylor Armerding points to ways the financial services industry could improve cybersecurity, from u... » read more

Siemens-Mentor Deal Retrospective
By Ed Sperling - 21 Aug, 2019 - Comments: 1

Tony Hemmelgarn, president and CEO of Siemens PLM Software and CEO of Mentor, a Siemens Business, sat down with Semiconductor Engineering to talk about the acquisition of Mentor Graphics, the shift toward more customized design, and where AI fits into the design picture. SE: How does a company like Siemens see the EDA industry evolving? Hemmelgarn: Part of the reason we bought Mentor Grap... » read more

Blog Review: Aug. 14
By Jesse Allen - 14 Aug, 2019 - Comments: 0

Cadence's Paul McLellan digs into Mary Meeker's analysis of Internet trends, from growth of the Inernet as a whole to cyber attacks, online finance, and the gig economy. Synopsys' Taylor Armerding warns that the financial services industry is aware of cybersecurity threats, but isn't doing enough to protect its networks and data. Mentor's Colin Walls considers a few cases where writing in... » read more

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